Exposure device and method

Abstract

The invention relates to an exposure device and a method thereof. The exposure method comprises: positioning a first mask plate provided with a first direction layout pattern and a second mask plate provided with a second direction layout pattern on a mask table which has an area for supporting the first mask plate and the second mask plate; positioning a wafer to be exposed on a wafer table; aligning the first mask plate with the wafer to be exposed; exposing the wafer in the first direction; aligning the second mask plate with the wafer to be exposed; and exposing the wafer in the second direction. The exposure device and the method thereof save the steps of converting the mask plates and aligning the mask plates with the mask table, so as to shorten exposure time, and improve production efficiency and performance of products.

Description

technical field [0001] The invention relates to a photolithography process, in particular to an exposure device and method. Background technique [0002] Photolithography is an indispensable and important technology in the integrated circuit manufacturing process. The photolithography process generally includes the following steps: First, apply a photosensitive material such as photoresist on the surface of the wafer, and after the photosensitive material is dried, expose the circuit design pattern on the mask to the photosensitive material with a specific light source through an exposure device. Then, develop the photosensitive material with a developer, and use the developed pattern as a mask to perform etching and other processes, and finally complete the transfer of the mask pattern. [0003] As the size of devices in the integrated circuit manufacturing process becomes smaller and smaller, the requirements for the photolithography process are also higher and higher. A...

AI Technical Summary

Problems solved by technology

[0012] The above bipolar exposure process will increase the time required for the exposure process due to the need to switch the reticle and calibrate the positions of the two reticles separately. Furthermore, it will take longer to perform bipolar exposure on multiple wafers. exposure time, thus reducing production efficiency

And the increase of the exposure time will increase the post-exposure delay time (PED, post-exposure delay), that is, the waiting time for post-exposure processing (for example, baking) on ​​the wafer will increase, and the wafer may be affected by the environment during the waiting process. The influence of temperature and pollution such as the diffusion of acidic substances, resulting in the reduction of exposure accuracy and product performance

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