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Adhesive mass for nonpolar substrates

A technology for adhesives, pressure-sensitive adhesives, applied in the direction of film/sheet adhesives, adhesive types, hydrocarbon copolymer adhesives, etc., which can solve the damage of cohesion, no improvement in usefulness, etc. problem, to achieve the effect of high bond strength

Inactive Publication Date: 2009-06-24
TESA SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

An increase in bond strength on non-polar substrates was actually found when using this adhesive, but its usefulness at low temperatures did not improve
In addition, it is known that the use of high content of diblock copolymer in PSA can increase its cohesive strength, but at the same time greatly impair its cohesion

Method used

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  • Adhesive mass for nonpolar substrates
  • Adhesive mass for nonpolar substrates
  • Adhesive mass for nonpolar substrates

Examples

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Embodiment Construction

[0067] Further advantages and possibilities for application will emerge from the working examples, which will be described in more detail below.

[0068] To illustrate the general concept of the invention, 5 different PSAs were illustratively prepared, and 2 additional PSAs were prepared as comparative examples (the latter containing components that are liquid at room temperature but cannot be used as tackifier resins). For this purpose, the individual components of the PSA were dissolved in toluene and the solids content of the resulting solution was adjusted to 40% by weight. The solution thus obtained was applied to one side of a polyester film (polyethylene terephthalate with a thickness of 36 μm) using a coating bar, and toluene was removed at 100° C. in the next drying step . A coatweight of 50 g / m was obtained in each case 2 .

[0069] As first block copolymer and as second block copolymer the following commercially available block copolymers were used:

[0070] Qui...

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Abstract

The present invention describes a pressure-sensitive adhesive which develops a high bond strength to substrates of low surface energies, even at low temperatures. The adhesive is composed of a first block copolymer A-B and a second block copolymer which is composed of at least two and not more than eleven connected subunits A-B, A being in each case a polymer block comprising vinylaromatic monomer units and B being in each case a poly(1,3-diene). The first block copolymer is present in the adhesive in a fraction of at least 50% by weight, based on the total mass of the block copolymers in the adhesive. The adhesive additionally contains tackifier resins, of which at least 30% by weight are liquid at room temperature and which are miscible with the polymer blocks B, but not with the polymer blocks A. An adhesive tape with the pressure-sensitive adhesive is also described.

Description

technical field [0001] The present invention relates to pressure sensitive adhesives comprising a tackifier resin, a first block copolymer having the general structure A-B and a second block copolymer consisting of at least two and no more than 11 subunits of the general structure A-B linked Block copolymers, A in each case comprising polymer blocks comprising monomer units derived from vinyl compounds containing at least one aromatic group, B in each case comprising units derived from unsubstituted and polymer blocks of monomeric units of substituted 1,3-dienes, said first block copolymer being present in an amount of at least 50% by weight, based on the total weight of the block copolymer in the adhesive, and the present invention It also relates to the use of pressure-sensitive adhesives of this type for the production of pressure-sensitive, essentially two-dimensional elements. The invention also relates to pressure-sensitive, substantially two-dimensional elements having...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02C09J7/00
CPCC09J153/025C09J153/02C08L2666/02C08L2666/24C09J125/08
Inventor 索斯滕·克拉温克尔克里斯琴·林
Owner TESA SE
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