Silicon chip placing apparatus used for photo-etching machine pre-alignment system

Abstract

The invention aims at solving the problem that silicon chip placing accuracy and accuracy repeatability are low in hand loading of the silicon chip and provides a silicon chip placing device applied to a prealignment system of a photoetching machine, comprising a supporting mechanism, a silicon chip clamping mechanism and a drive mechanism, wherein, the supporting mechanism is connected to the silicon chip clamping mechanism, the drive mechanism is used for driving the silicon chip clamping mechanism to move horizontally and vertically; the silicon chip clamping mechanism is composed of two clamping parts, the two clamping parts move face to face or in opposite directions under the effect of the drive mechanism, when the two clamping parts move face to face to end-to-end joint, the two parts are integrated into an accommodation space used for clamping the silicon chip. The silicon chip placing device of the invention can imitate the process of hand loading of the silicon chip, realizing the steps of clamping, moving, placing and other steps, as mechanical control is applied, repeatability precision of the placement of the silicon chip is ensured, thus greatly improving efficiency in prealignment debugging or maintenance of the silicon chip.

Description

technical field [0001] The invention relates to a silicon wafer placement device, in particular to a silicon wafer placement device used in a photolithography machine pre-alignment system. Background technique [0002] When pre-aligning silicon wafers in the current lithography machine, the silicon wafers are first placed on the pre-alignment table by the manipulator, and then rotated on the pre-alignment table to achieve pre-alignment. Due to the mechanical operation of the manipulator, it can ensure that every The accuracy of placing the silicon wafer is almost the same every time. Therefore, it is only necessary to adjust the position of the manipulator relative to the pre-alignment table before placing the silicon wafer for the first time to ensure that the silicon wafer can be pre-aligned correctly every time. [0003] However, when the silicon wafer cannot be placed on the pre-alignment table with the help of the robot, for example, the robot must be disengaged from t...

AI Technical Summary

Problems solved by technology

[0003] However, when the silicon wafer cannot be placed on the pre-alignment table with the help of the robot, for example, the robot must be disengaged from the pre-alignment table due to a failure of the silicon wafer transfer system; another example is when the silicon wafer is pre-aligned alone When the quasi-commissioning situation occurs, such situations occur. Since there is no robot arm, the silicon wafer can only be placed on the pre-alignment table manually for pre-alignment.

Manual operation leads to large differences in the accuracy of each placement, which can easily cause multiple pre-alignment failures and reduce the efficiency of pre-alignment

Moreover, once the pre-alignment fails, it is often difficult to distinguish whether the failure is caused by a wrong placement or the silicon wafer itself does not meet the requirements, so the judgment of the pre-alignment problem will have a great impact

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