Semiconductor encapsulation structure having substrate identification code and manufacturing method thereof

Abstract

The invention relates to a semiconductor encapsulation construct with a base plate identification code and a manufacturing method thereof. The lower surface of a base plate is formed with a circuit layer and a welding cover layer which roughly covers the circuit layer and a non circuit area. A wafer is arranged on the upper surface of the base plate. The base plate identification code escapes the circuit layer, is formed on the welding cover layer of the base plate or an adhesive body by laser marking and is used for marking product batch of the base plate. Therefore, the product batch can be traced by the encapsulation construct, and the encapsulation construct can be used for quality control and abnormal tracing while the appearance is not needed to be changed. In addition, the base plate identification code can be formed by utilizing the existing laser marking board for semiconductor encapsulation and the laser marking, thus being convenient for manufacture and not damaging the circuit layer of the base plate.

Description

Technical field [0001] The present invention relates to a semiconductor device, and in particular to a semiconductor packaging structure with a substrate identification code and a manufacturing method thereof. Background technique [0002] In the semiconductor packaging process, substrate strips (also called array packaging substrates or motherboards) are used as structural components. They are composed of multiple substrate units arranged in a matrix, and their number can range from tens to hundreds. many. After the semiconductor packaging is completed, the array substrates are cut to form independent separate chip packaging structures. For subsequent production management, quality control and product tracking, a substrate identification mark will be made on the substrate for management. However, the conventional substrate identification marks are formed during the substrate process, which increases the manufacturing cost and are covered or cut off during the semiconducto...

AI Technical Summary

Problems solved by technology

[0006] Another object of the present invention is to overcome the defects existing in the substrate identification code of the existing semiconductor package structure, and provide a new semiconductor package structure with a substrate identification code and its manufacturing method. The technical problem to be solved is in the laser There is no need to adjust the laser light or change the laser marking machine when marking, and the formation of the substrate identification code can be achieved by flipping the double-sided laser marking at one time, so the existing laser marking machine used for semiconductor packaging can be used and implemented simultaneously. The laser marking step has the convenience of production and will not damage the circuit layer of the substrate, so it is more suitable for practical use

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