Liquid ring pumping and reclamation systems in a processing environment

A liquid ring pump, recovery system technology, applied in the field of chemical management, can solve the problem of not being able to adequately control multiple process parameters

Active Publication Date: 2009-07-22
LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Currently, chemical management systems cannot adequately control multiple process parameters for certain applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid ring pumping and reclamation systems in a processing environment
  • Liquid ring pumping and reclamation systems in a processing environment
  • Liquid ring pumping and reclamation systems in a processing environment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Embodiments of the present invention present methods and chemical management systems for controlling aspects of fluid delivery and / or recovery.

[0024] System Overview

[0025] figure 1 One embodiment of a processing system 100 is shown. Generally, the processing system 100 includes a processing chamber 102 and a chemical management system 103 . According to one embodiment, the chemical management system 103 includes an input subsystem 104 and an output subsystem 106 . It is contemplated that any number of components of subsystems 104 , 106 may be onboard or offboard relative to process chamber 102 . In this context, "onboard" means that the subsystem (or its components) is integrated in a Fab (clean room environment) with the processing chamber 102, or more generally with the processing tool of which the processing chamber 102 is a part; while "Off-board" means that the subsystem (or components thereof) is separate and located at a distance from the process cham...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to methods and systems for chemical management. In one embodiment, a blender is coupled to a processing system and configured to supply an appropriate solution or solutions to the system. Solutions provided by the blender are then reclaimed from the system and subsequently reintroduced for reuse. The blender may be operated to control the concentrations of various constituents in the solution prior to the solution being reintroduced to the system for reuse. Some chemicals introduced to the system may be temperature controlled. A back end vacuum pump subsystem separates gases from liquids as part of a waste management system.

Description

technical field [0001] The present invention relates to methods and systems for managing chemicals in processing environments, such as semiconductor manufacturing environments. Background technique [0002] In a variety of industries, chemical delivery systems are used to supply chemicals to process equipment. Example industries include the semiconductor industry, the pharmaceutical industry, the biomedical industry, the food processing industry, the household products industry, the personal care products industry, the petroleum industry, and the like. [0003] Of course depending on the specific process being performed, the chemicals are delivered by a given chemical delivery system. Accordingly, the specific chemicals supplied to semiconductor processing equipment depend on the processes being performed on the wafers in the equipment. Exemplary semiconductor processes include etching, cleaning, chemical mechanical polishing (CMP), and wet deposition (eg, chemical vapor d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B01F15/04H01L21/00
Inventor K·J·厄克特G·瓜尔内利J-L·马克N·方雅L·兰格里尔C·科林J-L·马克
Owner LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products