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Dicing/die-bonding tape and method for manufacturing semiconductor chip

A chip bonding and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, film/sheet adhesives, etc., can solve problems such as reducing adhesion, achieve the effect of preventing damage and realizing the manufacturing process

Inactive Publication Date: 2011-07-13
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using such a dicing film or a dicing and die bonding film, the adhesive is cured by irradiating ultraviolet rays, radiation, or light after slicing to reduce the adhesive force.

Method used

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  • Dicing/die-bonding tape and method for manufacturing semiconductor chip
  • Dicing/die-bonding tape and method for manufacturing semiconductor chip
  • Dicing/die-bonding tape and method for manufacturing semiconductor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0233] Mix G-2050M (manufactured by NOF Corporation, epoxy group-containing acrylic polymer, weight average molecular weight Mw 200,000) 15 parts by weight, EXA-7200HH (manufactured by Dainippon Ink Co., Ltd., dicyclopentadiene type epoxy) 70 Parts by weight, HP-4032D (manufactured by Dainippon Ink Co., Ltd., naphthalene type epoxy) 15 parts by weight, YH-309 (manufactured by Japan Epoxy Resin Company, anhydride curing agent) 38 parts by weight, 2MAOK-PW (Shikoku Chemical Industry Co., Ltd. production, imidazole) 8 parts by weight, S320 (manufactured by cisso company, aminosilane) 2 parts by weight and MT-10 (manufactured by Tokuyama company, surface hydrophobized fumed silica) 4 parts by weight, the mixture was added to the solvent The solid content was adjusted to 60% in methyl ethyl ketone (MEK) and stirred to obtain a coating liquid. This coating solution was applied on a release film to a thickness of 40 μm, and heated and dried in an oven at 110° C. for 3 minutes to form...

Embodiment 2

[0236] 4 layers of slices and die-bonding tapes were made in a manner similar to that of Example 1, except that an LDPE film (the LDPE film obtained by extruding the T-die head of Millasson (ミラソン) M12 manufactured by Mitsui Chemicals Co., Ltd., was used, Extrusion temperature 200° C., film thickness 50 μm) was used as a non-adhesive film.

Embodiment 3

[0238] Four-layer slices and die-bonding tapes were produced in a manner similar to that of Example 1, except that a T-die head of HI-ZEX (ハイゼツクス) 3300F manufactured by a primepolymer (primepolymer) company was used. The obtained HDPE film was extruded (extrusion temperature: 200° C., thickness: 50 μm) as a non-adhesive film.

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PUM

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Abstract

Provided is a dicing / die-bonding tape which permits a semiconductor chip to be easily and surely picked up at the time of dicing a semiconductor wafer and picking up the semiconductor chip together with a die-bonding film. A dicing / die-bonding tape is used for dicing a wafer, obtaining a semiconductor chip and die-bonding the semiconductor chip. The dicing / die-bonding tape is provided with a die-bonding film and a nonadhesive film attached to one surface of the die-bonding film. The peeling strength of the die-bonding film and the nonadhesive film is within a range of 1-6N / m and the shear strength of the die-bonding film and the nonadhesive film is 0.3-2N / mm<2>.

Description

technical field [0001] The present invention relates to a slice and a die-bonding tape used in the manufacture of a semiconductor chip. Specifically, the present invention relates to a slice and a die-bonding tape that are attached to a semiconductor wafer and used during slicing and chip bonding, and the use of the slice And a semiconductor chip manufacturing method of a chip bonding tape. Background technique [0002] Conventionally, in order to cut out a semiconductor chip from a semiconductor wafer and mount it on a substrate or the like, a die-bonding tape is used. A semiconductor wafer is pasted on one side of the die-bonding film, and a dicing film is pasted on the opposite side of the die-bonding film. At the time of dicing, the semiconductor wafer is sliced ​​together with the die-bonding film. After slicing, the die-bonding film is peeled off from the dicing film to which the semiconductor chip is bonded, and the semiconductor chip is taken out together with the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301C09J7/02H01L21/52
CPCH01L24/29H01L2924/01094H01L21/6836H01L2924/01074H01L24/27H01L2924/01027H01L2924/01047H01L21/67132H01L2924/0106H01L2224/2919C09J2203/326H01L2924/01013H01L2924/01005H01L2224/8385H01L24/83H01L2924/01033H01L2924/01075H01L2924/01082H01L2224/274H01L2224/83191H01L2221/68327H01L2924/01015H01L2924/10253H01L2924/0665C09J7/0217H01L2924/01006H01L2924/01019H01L2924/07802H01L2924/01023C09J7/385Y10T428/2891Y10T428/2848Y10T428/28Y10T428/25H01L2924/00H01L2924/3512C09J7/38
Inventor 渡部功治正原和幸松田匠太福冈正辉竹部义之
Owner SEKISUI CHEM CO LTD
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