Copper linking mercerization brightening thermal treatment protection device
A protective device and copper bonding technology, applied in the field of protective devices, can solve problems such as potential safety hazards, and achieve the effect of eliminating potential safety hazards
Inactive Publication Date: 2011-03-23
HENAN YOUK ELECTRONICS MATERIALS
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Problems solved by technology
However, H 2 It is a flammable and explosive gas. If there is a large amount of gas leakage during the production process of bonding wire, there will be a big safety hazard.
Method used
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Embodiment
[0016] Embodiment: The protective device during the heat treatment of copper bonding wires as shown in the figure includes a gas chamber 10, and the inner cavity of the gas chamber 10 is divided into a left gas chamber 8 and a right gas chamber 7 by a partition 14, wherein The left air chamber 8 is provided with an exhaust pipe 9 communicating with the left air chamber 8, the right air chamber 7 is provided with an exhaust pipe 1 communicating with the right air chamber 7, and the right air chamber 7 is also provided with a right air The hydrogen gas inlet pipe 4 connected to the chamber 7 is equipped with an inert gas inlet nozzle 15 at the lower end of the right gas chamber 7. The inert gas inlet nozzle 15 is a fan-shaped structure, and its center is the same as the center of the exhaust pipe 1 on the right chamber 7 Shaft, which ensures that a good air shield can be formed, and effectively prevents gas from leaking or entering the left air chamber 8. An inert gas inlet pipe ...
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The invention discloses a protective device for a copper bonded silk bright heat treatment. The device comprises an air chamber, wherein the upper end of the air chamber is provided with an exhaust pipe communicated with the air chamber; the lower end of the air chamber is provided with a suction nozzle and an inert gas inlet pipe; the inner cavity of the air chamber is separated into a left air chamber and a right air chamber by a clapboard; the side wall of the left air chamber and the clapboard are provided with threaded holes which are coaxial; the left air chamber is provided with an exhaust pipe communicated with the left air chamber; the right air chamber is provided with an exhaust pipe communicated with the right air chamber and is also provided with a hydrogen inlet pipe communicated with the right air chamber; the lower end of the right air chamber is provided with an inert gas inlet nozzle; and the inert gas inlet nozzle is provided with the inert gas inlet pipe. The device avoids leakage of combustible and explosive gas H2 during the thermal treatment, eliminates potential safety hazard, and can obtain copper bonded silk bright heat treatment effect, thereby providingequipment guarantee for the high-quality copper bonded silk material.
Description
Technical field [0001] The invention belongs to a protection device in a copper key table wire brightening heat treatment process equipment. Background technique [0002] Compared with gold wire and aluminum wire, copper bonding wire has excellent mechanical properties, electrical properties, thermal properties and low intermetallic compound growth, which improves chip frequency and reliability, and adapts to low cost, fine pitch, and high lead The development of end component packaging has become the best bonding material to replace gold wire. However, because copper is more active than gold and aluminum, it can be oxidized at room temperature. The current special equipment for bonding alloy wires and aluminum wires cannot meet the needs of preparing copper bonding wires. At the same time, due to the high technical requirements of the bonding wire, slight oxidation of the surface of the bonding wire will reduce the reliability of semiconductor components by 60%. Therefore, the...
Claims
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IPC IPC(8): C23F17/00C22F1/08C23G5/00
Inventor 吕长江吕长春
Owner HENAN YOUK ELECTRONICS MATERIALS