Pick-up method and pick-up device

A pickup device, horizontal technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of chip 1 position shift, falling off, etc., to achieve the effect of easy peeling

Active Publication Date: 2009-08-19
CANON MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the retention of the chip 1 during peeling can be maintained only by the adsorption force of the collet 7, therefore, the chip (chip device) 1 side may not be able to withstand the force of peeling when sliding, and the chip 1 falls off from the collet 7, Or, due to the sliding action of the support part 4, the adhesive sheet 2 is pulled, and the position of the chip 1 may be shifted.

Method used

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  • Pick-up method and pick-up device

Examples

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Embodiment Construction

[0037] Below, based on Figure 1 to Figure 7 , to describe the embodiment of the present invention.

[0038] figure 2 The pick-up device of the present invention is shown in . This pick-up device is a device that sequentially peels and takes out a plurality of rectangular thin-walled chip devices (semiconductor chips) 11 attached to the adhesive sheet 12 from the adhesive sheet 12 .

[0039] Chip device 11 is passed with wafer W (referring to image 3 ) is a raw material, and the raw material is cut into a rectangular shape to become a final product. Therefore, the chip device 11 includes square or strip-shaped chip devices and the like. That is, if image 3 As shown, the wafer W is circular as a whole, and is divided into individual chip devices 11 by dicing, and the chip devices 11 are attached to an adhesive plate 12 . In addition, a frame 13 made of a ring is attached to the outer peripheral side of the adhesive sheet 12 . That is, the frame 13 and the adhesive sheet...

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PUM

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Abstract

A method of pickup and pickup apparatus that lower the possibility of cracking of neighboring pellets and realize unfailing easy detaching and taking out of pellets to be detached. Multiple rectangular thin pellets (11) stuck onto pressure sensitive adhesive sheet (12) are sequentially detached from the pressure sensitive adhesive sheet (12) and taken out. While retaining each pellet (11) to be detached from above, suction from below is applied to the pressure sensitive adhesive sheet (12). Simultaneously with the air suction and pellet retention from above, while supporting the pressure sensitive adhesive sheet (12) from below by means of protrusions (25) for insertion in apertures (19), receiving part (17) is traveled in the horizontal direction to thereby realize detaching of the pellet (11).

Description

technical field [0001] The invention relates to a picking method and a picking device. Background technique [0002] In the manufacturing process of a semiconductor device, it is necessary to pick up a diced semiconductor chip-shaped device (hereinafter, simply referred to as a chip-shaped device) from an adhesive sheet. A conventional pick-up device includes: a stage holding an adhesive plate; a push-up stage that advances and retreats with respect to the stage; and a needle-shaped object that is pushed up by the push-up stage. That is, the needle-shaped object pushed up by the push-up stage pushes up the adhesive sheet against the stage from the back side, and detaches the pellet from the adhesive sheet. [0003] However, in a pick-up device using a needle, the tip of the needle may be worn, damaged, or bent when the needle pierces the adhesive sheet, pushes up the chip, and peels it off the adhesive sheet. In this case, the inside of the pellet may sometimes be damaged ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67132H01L21/67H05K13/04
Inventor 中津显
Owner CANON MACHINERY
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