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Flexible printed wiring board and electronic apparatus

A technology of flexible printing and electronic equipment, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem of low durability

Inactive Publication Date: 2009-08-26
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there are limitations in the use of double-sided FPC in movable parts since durability may become lower

Method used

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  • Flexible printed wiring board and electronic apparatus
  • Flexible printed wiring board and electronic apparatus
  • Flexible printed wiring board and electronic apparatus

Examples

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Embodiment Construction

[0025] Various embodiments according to the present invention will be described below with reference to the accompanying drawings. Generally, according to one embodiment of the present invention, a flexible printed wiring board includes: a base layer including one surface and another surface, one surface is exposed; a signal layer formed on the other surface of the base layer; a cover layer on the cover layer to cover the signal layer; and a ground layer plated on the cover layer to cover the signal layer, the ground layer includes a conductive paste in which metal powder and metal nanoparticles are mixed.

[0026] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0027] figure 1 The cross-sectional structure of the flexible printed wiring board of the Example of this invention is shown. figure 2 Shows the planar structure of the entire flexible printed wiring board. image 3 Show it enlarged figure 2 The p...

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Abstract

An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed. The present invention also provides the electronic apparatus including the flexible printed wiring board.

Description

technical field [0001] The present invention relates to a flexible printed wiring board more suitable for use in a circuit for processing high frequency band signals in a differential transmission system. Background technique [0002] A flexible printed wiring board is often used in information processing equipment due to its flexibility enabling it to be installed in a box in a bent state and its high degree of freedom in wiring. Accompanying the increase in processing speed and circuit density in information processing equipment, flexible printed wiring boards mounted in casings of such equipment have been required to form a high frequency band for transmission in consideration of transmission loss by using printed wiring Signal transmission line technology. This is based on the point of view of the transition from the microwave (UHF) band to the centimeter wave (SHF) band, or from the centimeter wave band to the millimeter wave (EHF) band. [0003] When the signal trans...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/09H01L23/522
CPCH05K2201/09618H05K1/095H05K1/0393H05K1/0218H05K2201/0266H05K1/0219H05K2201/0272H05K3/281H05K1/0237H05K2201/0715H05K2201/0257H05K3/4664H05K2201/09236
Inventor 室生代美八甫谷明彦鸟越保辉
Owner KK TOSHIBA