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Electronic device structure

A technology for electronic devices and components, applied in the fields of electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of increased manufacturing cost, excessive time consumption, and inconvenience of heat shields.

Inactive Publication Date: 2009-09-02
MICRO-STAR INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat shield is an additional component for the notebook computer, and it is inconvenient to carry the heat shield additionally for the user who needs to carry the notebook computer frequently.
[0007] To sum up, the manufacturer must add an additional height adjustment mechanism or a heat shield to the notebook computer, and the components of the height adjustment mechanism are complicated, and it takes too much time to assemble during the assembly process, which will lead to The increase in manufacturing costs does not meet the current requirements of the manufacturing industry to reduce costs

Method used

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Embodiment Construction

[0031] The electronic device structures disclosed in the present invention include clamshell computer devices such as notebook computers, tablet computers, ultra-mobile computers (UMPCs), and personal digital assistants (PDAs), but are not limited thereto. In the following detailed description of the present invention, a notebook computer will be taken as the preferred embodiment of the present invention. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.

[0032] see Figure 1A and Figure 1B The schematic diagram of the electronic device structure 100 of the first embodiment of the present invention includes a first component 110 and a second component 120, wherein the first component 110 is a display screen to display relevant information of the current operation, and the second component 120 Refers to the main body of the electronic device structure 100, which executes the preset functi...

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PUM

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Abstract

The invention relates to an electronic device structure which comprises a first component and a second component, wherein one end of the first component is pivotally connected with one end of the second component in the relation of relative rotation; and the distance between one side of the first component close to the pivotal joint part and the pivotal joint part is larger than the distance between the bottom of the second component and the pivotal joint part. When the first component is rotated to a use position relative to the second component, the outer edge of one side of the first component close to the pivotal joint part abuts against one plane, so that the second component is obliquely arranged on the plane and an auxiliary heat-dissipating airflow space is formed.

Description

technical field [0001] The invention relates to an electronic device structure, in particular to an electronic device structure that can be placed on a plane at an inclined angle. Background technique [0002] With the rapid development of high-tech industries such as computer information and the expansion of their application scope, in order to meet consumers' requirements for data processing speed, the computing speed of the electronic components inside the computer device must be fast, coupled with the small size of the electronic components, resulting in The heating density also increases accordingly. If a large amount of heat energy is not dissipated in time, it will cause damage to electronic components and affect the stability and operating performance of computer equipment. [0003] Take a notebook computer as an example. Generally, when using a notebook computer, most of them are placed on the table for easy operation. Most of the heat dissipation holes of the note...

Claims

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Application Information

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IPC IPC(8): G06F1/16G06F1/20
Inventor 陈正隆
Owner MICRO-STAR INTERNATIONAL
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