Solid electrolytic capacitor and manufacture method thereof

Abstract

The invention provides a solid electrolytic capacitor and a manufacture method thereof. The solid electrolytic capacitor comprises anode foil, cathode foil, a rectangular core package, electrode extraction terminals and a packaging body, wherein the rectangular core package is formed by coiling a solid electrolytic layer clamped between the anode foil and the cathode foil, and the electrode extraction terminals are connected with the core package which is coated by the packaging body. The method comprises the following steps: providing the anode foil, the cathode foil and electrolytic paper which are cut into special widths; connecting the electrode extraction terminals with the anode foil and the cathode foil; coiling the anode foil, the cathode foil and the electrolytic paper into a cylindrical stud; deforming the cylindrical stud into the rectangular core package; forming the solid electrolytic layer between the anode foil and the cathode foil of the core package; connecting the electrode extraction terminals of the core package with a pin frame; and packaging the core package. The technical scheme can realize an SMD solid electrolytic capacitor with lower height so as to occupy a smaller thickness space and satisfy the higher requirements for thin electronic equipment.

Description

technical field [0001] The invention relates to the technical field of electrolytic capacitors, in particular to a solid electrolytic capacitor and a manufacturing method thereof. Background technique [0002] In recent years, with the development of high-performance and miniaturized electronic equipment, resin-molded chip components suitable for high-density mounting of electronic components have gradually become mainstream. Aluminum electrolytic capacitors are no exception, and aluminum electrolytic capacitors using surface mount technology (Surfaced Mounting Technology, SMT) are widely used. [0003] Surface mount technology is a new generation of electronic assembly technology, which compresses traditional electronic components to only a few tenths of the original volume, thus realizing high density, high reliability, miniaturization and low cost of electronic product assembly , and automation of production. However, the general surface mount of aluminum electrolytic c...

AI Technical Summary

Problems solved by technology

However, the problem is that when the cylindrical core package is packaged, it is limited by the diameter of the core package, resulting in the packaged capacitor still occupying a large thickness space, which cannot meet the higher requirements for thinner electronic equipment.

In addition, in the manufacturing process of the solid electrolyte layer of polyaniline, the first layer of chemical polymerization followed by the second layer of electrolytic polymerization is used, and it must be repeated many times, resulting in low production efficiency

Images