A laser marking method on wafer surface

A laser marking method and laser marking machine technology, applied in laser welding equipment, electrical components, circuits, etc., to achieve the effects of good durability, high material utilization rate, and improved energy utilization rate

Inactive Publication Date: 2009-09-16
ZHEJIANG CRYSTAL OPTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned defects, the technical problem to be solved in the present invention is to provide a laser marking method on the surface of a wafer, whi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0024] The laser marking method of the wafer surface of the present invention uses a laser marking machine to mark the surface of the wafer. The surface of the wafer that can reflect the laser is marked. The surface has a functional film layer that can reflect laser light. When performing laser marking, a laser marking machine is mainly used to ablate a three-dimensional mark on the surface of the wafer. The method includes the following sequential steps: making a marking sheet, the substrate of the marking sheet is a glass sheet that can transmit laser light, a metal film layer of a certain thickness is formed on a single side surface of the glass sheet, and the laser light irradiates the metal film The layer will be blocked by the metal film layer and accumulate. The thickness of the metal film layer should ensure that it can be melted through by the laser emitted by the laser marking machine;

[0025] The bonding of the marking sheet to the surface of the wafer, so that the sur...

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Abstract

A laser marking method on wafer surface includes: production of marking films, wherein, the matrix for marking films is glass sheets capable of permeating the laser, a metallic film layer with a certain thickness is formed on the single side surface of the glass sheet, the laser irradiates on the metallic film layer, and is blocked and accumulated by the metallic film layer, the thickness of the metallic film layer can ensure that the metallic film layer can be melted through by the laser irradiated by the laser marking machine; jointing of the marking film and the wafer surface, so that the metallic film layer surface on the marking film are jointed together with the position on the wafer surface required to mark; laser marking, using laser marking machine to irradiate laser to the position of the wafer required to mark from one side of the marking film without metallic film layer, the irradiated laser is blocked by the metallic film layer and accumulated at the metallic film layer, the accumulated laser can melt through the metallic film layer to ablate the wafer surface, for forming making on the wafer surface. So that three-dimensional effect makings can expediently be marked at wafer surfaces with various characteristics.

Description

technical field [0001] The invention relates to a marking method on the surface of an object by using a laser, in particular to a marking method on a wafer surface by using a laser. Background technique [0002] On some glass sheets, such as the surface of wafers such as mobile phone or camera filter, sometimes they need to be marked. There are mainly two methods for marking on the wafer, one is to paste a paper mark on the surface of the wafer, and the other is to use a laser to ablate a three-dimensional mark on the surface of the wafer. Paper marks have been phased out due to their short service life and great impact on the light transmission effect of the chip; while the method of marking on the surface of the chip with a laser has basically the same life as the chip and is not easy to be damaged. be widely applied. [0003] Under the existing technical conditions, when using a laser to mark the surface of a wafer, the required equipment is a laser marking machine and ...

Claims

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Application Information

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IPC IPC(8): H01L21/268B23K26/00H01L23/544B23K26/18B23K26/362
Inventor 郑光王喜
Owner ZHEJIANG CRYSTAL OPTECH
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