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Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same

A semiconductor tube and core sealing technology, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc.

Inactive Publication Date: 2009-09-16
FAIRCHILD SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These requirements are conflicting, and it has so far been difficult to achieve all of them simultaneously

Method used

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  • Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same
  • Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same
  • Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same

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Embodiment Construction

[0018] figure 1 An exploded perspective view of an exemplary multiple semiconductor die package 10 according to the present invention is shown. Package 10 includes a first substrate 100, a second substrate 200, a plurality of transistor semiconductor die 20A-20F, a plurality of rectifier semiconductor die 30A-30F, a plurality of conductive members 40C-40F, a low side driver chip 50, a plurality of high Side drive chips 60A- 60C, and a plurality of wire bonds 70 . The first substrate 100 has an upper surface 101 , a lower surface 102 , and a plurality of conductive regions 120A- 120F, 124 , 125A- 125F, 150 , 160 disposed on the first surface 101 . The second substrate 200 includes a first surface 201 and a second surface 202 (such as figure 2 shown), and a plurality of conductive regions 211-214 formed on the first surface 201. In package 10 in assembled form, first surface 101 of substrate 100 and first surface 201 of substrate 200 are assembled together (in the areas of c...

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Abstract

Disclosed are semiconductor die packages, methods of making them, and systems incorporating them. An exemplary package comprises a first substrate, a second substrate, a semiconductor die disposed between the first and second substrates, and an electrically conductive member disposed between the first and second substrates. The semiconductor die has a conductive region at its first surface that is electrically coupled to a first conductive region of the first substrate, and another conductive region at its second surface that is electrically coupled to a first conductive region of the second substrate. The conductive member is electrically coupled between the first conductive region of the second substrate and a second electrically conductive region of the first substrate. This configuration enables terminals on both surfaces of the semiconductor die to be coupled to the first substrate.

Description

Background technique [0001] Current Smart Power Module (SPM) products focus on high-power applications such as motor drives for air conditioners, washing machines, refrigerators, and other home appliances. These modules typically include one or more semiconductor power devices and one or more control chips or driver chips packaged together in a dual-in-line package, and the components are mounted on a lead frame and electrically interconnected with wire bonds . Intelligent power modules for the above-mentioned applications must be small and inexpensive on the one hand and have high reliability on the other hand. These requirements are conflicting, and until now it has been difficult to achieve all of them simultaneously. Contents of the invention [0002] As part of their invention, the inventors have discovered that an SPM package with a smaller size and a bank grid array or ball grid array connector structure instead of a dual in-line pin connector structure enables devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L21/60H05K1/18
CPCH01L2224/48091H01L23/49816H01L23/49844H01L23/3735H01L23/5385H01L2924/3025H01L2924/13091H01L2924/1305H01L2924/00014H01L2924/00H01L23/48
Inventor Y·刘刘玉敏杨华T·A·麦尔道
Owner FAIRCHILD SEMICON CORP