Method and device for acquiring optimal parameters of photoetching machine

Abstract

The invention discloses a method for acquiring optimal parameters of a photoetching machine. The method is used for setting the required resolution and comprises the following steps: inputting parameters and calculating cut off numerical aperture value; judging whether the current numerical aperture value is less than the cut off numerical aperture value, if so, calculating and saving depth of focus value and the resolution which correspond to the current numerical aperture value; increasing the numerical aperture value, using the increased step length of numerical aperture as new current numerical aperture value, and recalculating the numerical aperture value; and otherwise, selecting and outputting the a set of depth of focus values of which the resolution is less than the required resolution and the depth of focus value is largest, the resolution and the numerical aperture value corresponding to the depth of focus value and the resolution. The invention also discloses a device for acquiring optimal parameters of a photoetching machine, which selects and outputs an optimal set of depth of focus values, the resolution and the corresponding numerical aperture value. The method improves the machine debugging efficiency and prolongs the service life of the silicon chips.

Description

technical field [0001] The invention relates to a semiconductor photolithography process, in particular to a method and a device for obtaining optimal parameters of a photolithography machine. Background technique [0002] Lithography machine is one of the core technologies of semiconductors, mainly used in the photolithography process of ultra-small line width graphics of semiconductors. Usually, before the mass production of the lithography machine, the parameters of the lithography machine need to be debugged to ensure the use effect of the lithography machine. In the process of lithography machine debugging, there are two important parameters that need to be handled carefully, namely resolution (Resolution) and depth of field (DOF, Depth Of Focus). Depth of field involves the concept of the circle of confusion. The so-called circle of confusion means that light begins to gather and diffuse before and after the focal point of the lens, and the image gradually becomes blu...

AI Technical Summary

Problems solved by technology

In this way, multiple trial engravings are required, which increases the complexity of lithography machine debugging. Although the silicon wafers after trial engraving can be reused, the service life of the silicon wafers is also affected.

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