Serial-parallel type multi-evaporator loop heat pipe

Abstract

A serial-parallel type multi-evaporator loop heat pipe comprises at least two groups of evaporators, at least two gas-liquid pipelines, at least two groups of condensers and at least one group of working fluid compensation chamber. The arrangement of a plurality of evaporators adopts a sequential serial-parallel type, namely the gas-liquid pipelines are used for connecting a back evaporator liquid inlet with a front steam outlet and connecting the steam outlet of the final evaporator with the first liquid inlet of the first evaporator; the gas-liquid pipeline is provided with the condenser; and the multi-group of the evaporators commonly use at least one group of working fluid compensation chambers that are connected with each other by the liquid compensation pipelines. The loop heat pipe can meet the simultaneous heat dissipation requirement of a plurality of heat sources, is mainly applicable to the heat dissipation of computer chips, and can be also used for the cooling of light-emitting diode lighting equipment, chips in communication industries and internal high-energy heating parts of military, medical and aerospace equipment.

Description

technical field [0001] The invention relates to the field of heat dissipation product manufacturing, in particular to a structure of a series-parallel multi-evaporator loop heat pipe. Background technique [0002] The cooling of high-power heat sources, especially high-power electronic chips, is a very important technical link in electronics, computers, communications and optoelectronic equipment. At present, the commonly used methods for heat dissipation of high-power electronic devices in the market include the following: (1) fan + radiator; (2) fan + heat pipe + radiator; (3) fan + liquid cooling technology. They can solve the heat dissipation problem of high-power devices to a certain extent, but there are the following disadvantages: (1) fan + heat sink, in order to enhance the heat dissipation capacity of the heat dissipation device, only by increasing the area of ​​the heat dissipation fins and increasing the fan speed, resulting in The result is that the noise is la...

AI Technical Summary

Problems solved by technology

They can solve the heat dissipation problem of high-power devices to a certain extent, but there are the following disadvantages: (1) fan + heat sink, in order to enhance the heat dissipation capacity of the heat dissipation device, only by increasing the area of ​​the heat dissipation fins and increasing the fan speed, resulting in The result is that the noise is large, the heat sink is large and heavy, which is not conducive to installation and will generate a lot of pressure on electronic devices; (2) fan + heat pipe + radiator can solve the shortcomings in method 1, but it will increase the mechanism itself. The complexity, design and installation of heat pipes are often limited by the actual structure, and under the action of limited heat pipes, its heat dissipation capacity is still limited; 3) Liquid cooling technology, which surpasses the above two methods in performance, and liquid cooling heat dissipation technology The potential is very high. If a small liquid cooling device is optimized in performance, it can dissipate 1000 watts of heat under the premise of controlling noise (the overall thermal resistance of the liquid cooling radiator can be as low as 0.12°C / W or less. )

Due to the limitations of the loop heat pipe itself, the potential of a single loop heat pipe cannot be fully explored, especially for loop heat pipes with high manufacturing costs. For the heat dissipation of multi-point high-calorie heat sources, if a single evaporator structure is used, the overall cost is expensive. and cannot coordinate the balance of cooling requirements between heat sources

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