Fixing piece and heat dissipating device using same

一种散热装置、固定件的技术，应用在半导体/固态器件零部件、锁紧紧固件、螺纹紧固件等方向，能够解决生锈、操作繁琐、脱落杆件等问题

Inactive Publication Date: 2009-10-28
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fixing device is prone to shaking, causing the snap ring to deform and fall off, or the snap ring to scratch the coating on the outside of the rod, causing the rod to rust, forming a hidden danger
In addition, during the installation process, the small snap ring must be snapped onto the slot of the rod, which is cumbersome to operate

Method used

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  • Fixing piece and heat dissipating device using same
  • Fixing piece and heat dissipating device using same
  • Fixing piece and heat dissipating device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] see figure 1 , a heat dissipation device according to a preferred embodiment of the present invention is used for dissipating heat from a heat-generating electronic component (not shown) mounted on a circuit board (not shown). The heat dissipation device includes a heat sink 10 and several fixing pieces 20 for fixing the heat sink 10 on the electronic components.

[0014] Please also refer to figure 2 The heat sink 10 includes a bottom plate 12 , a heat sink set 14 arranged on the bottom plate 12 , and a heat pipe 16 connecting the bottom plate 12 and the heat sink set 14 through further heat conduction. The bottom plate 12 is roughly a rectangular flat body, the bottom of which is in contact with the electronic components. The base plate 12 is provided with a perforation 120 penetrating up and down in the middle of the two sides, and a depression 122 is formed at the bottom of the base plate 12 corresponding to the perforation 120, so that the thickness of the base ...

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PUM

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Abstract

The invention relates to a heat dissipating device which is used for dissipating heat of an electronic element on a circuit board and comprises a radiator and a plurality of fixing pieces fixing the radiator on the electronic element, the radiator comprises a bottom plate and a radiating fin set attached on the bottom plate; each fixing piece comprises a sleeve, a rod piece penetrated into the sleeve and a spring sleeved on the rod piece, wherein the rod piece comprises a head part, a rod body extending from the head part and a threaded section formed at the tail end of the rod body, the sleeve comprises a cylinder body positioned on the bottom plate and a combination cylinder formed at the bottom of the cylinder body, the combination cylinder is penetrated into the bottom plate and is fixed and clamped with the bottom plate, the rod body is penetrated into the combination cylinder, and the threaded section is clamped under the combination cylinder. Being provided with the sleeve and the combination cylinder, the fixing piece can be conveniently connected with the rod piece and the spring and can also be convenient for being clamped on the bottom plate of the radiator for fixing, the heat dissipating device is not prone to the hidden trouble of leading the springs, the rod pieces and the sleeves to be fallen because of inadvertency during the installation.

Description

technical field [0001] The invention relates to a fixing part and a heat dissipation device using the fixing part. Background technique [0002] With the rapid development of the computer industry, the operating capabilities of electronic components such as central processing units continue to improve, and their heat generation is also increasing. Heat dissipation has become a problem that must be solved when these heat-generating electronic components are used. At present, the solution commonly adopted in the industry is to install a heat sink on the electronic components to dissipate heat. The radiator needs to be fixed on the electronic components with a fixing device. The effect of this fixing device will directly affect the heat sink and electronic components. The heat exchange efficiency between components affects the heat dissipation effect. [0003] The fixing device disclosed in US Patent No. 5,901,039 is a screw-fit fixing device commonly used in the industry. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/40F16B39/00
CPCH01L23/467H01L23/4006H01L23/427H01L23/3672H01L2924/0002Y10T24/42H01L2924/00
Inventor 鲁翠军
Owner FU ZHUN PRECISION IND SHENZHEN
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