Fixing piece and heat dissipating device using same
一种散热装置、固定件的技术,应用在半导体/固态器件零部件、锁紧紧固件、螺纹紧固件等方向,能够解决生锈、操作繁琐、脱落杆件等问题
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0013] see figure 1 , a heat dissipation device according to a preferred embodiment of the present invention is used for dissipating heat from a heat-generating electronic component (not shown) mounted on a circuit board (not shown). The heat dissipation device includes a heat sink 10 and several fixing pieces 20 for fixing the heat sink 10 on the electronic components.
[0014] Please also refer to figure 2 The heat sink 10 includes a bottom plate 12 , a heat sink set 14 arranged on the bottom plate 12 , and a heat pipe 16 connecting the bottom plate 12 and the heat sink set 14 through further heat conduction. The bottom plate 12 is roughly a rectangular flat body, the bottom of which is in contact with the electronic components. The base plate 12 is provided with a perforation 120 penetrating up and down in the middle of the two sides, and a depression 122 is formed at the bottom of the base plate 12 corresponding to the perforation 120, so that the thickness of the base ...
PUM
![No PUM](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/noPUMSmall.5c5f49c7.png)
Abstract
Description
Claims
Application Information
![application no application](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/application.06fe782c.png)
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com