Fixing piece and heat dissipating device using same
一种散热装置、固定件的技术,应用在半导体/固态器件零部件、锁紧紧固件、螺纹紧固件等方向,能够解决生锈、操作繁琐、脱落杆件等问题
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[0013] see figure 1 , a heat dissipation device according to a preferred embodiment of the present invention is used for dissipating heat from a heat-generating electronic component (not shown) mounted on a circuit board (not shown). The heat dissipation device includes a heat sink 10 and several fixing pieces 20 for fixing the heat sink 10 on the electronic components.
[0014] Please also refer to figure 2 The heat sink 10 includes a bottom plate 12 , a heat sink set 14 arranged on the bottom plate 12 , and a heat pipe 16 connecting the bottom plate 12 and the heat sink set 14 through further heat conduction. The bottom plate 12 is roughly a rectangular flat body, the bottom of which is in contact with the electronic components. The base plate 12 is provided with a perforation 120 penetrating up and down in the middle of the two sides, and a depression 122 is formed at the bottom of the base plate 12 corresponding to the perforation 120, so that the thickness of the base ...
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