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Electrode plate

A technology of electrode plates and conductive substrates, which is applied to circuits, discharge tubes, electrical components, etc., and can solve problems such as excessive deposition of electric field distribution films, insufficient etching, and damage to semi-finished products

Inactive Publication Date: 2009-11-25
CONTREL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The uneven distribution of the electric field can easily lead to over-etching or under-etching of the plasma
Similarly, uneven electric field distribution can lead to over-deposition or under-deposition of films
Work-in-progress can be damaged when plasma etching and deposition are not as effective as expected

Method used

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  • Electrode plate
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Examples

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Embodiment Construction

[0064] Please refer to figure 2 , which shows a side view of the structure of the electrode plate 100 according to the first embodiment of the present invention, wherein the power supply P rf is a radio frequency power supply, however in other embodiments of the present invention, the power supply P rf Other kinds of power sources are possible and are not limited to radio frequency power sources. The electrode plate 100 includes a conductive substrate 102 and a plurality of material layers 104a, 104b and 104c, wherein the electrical conductivity of the material layer 104c is greater than the electrical conductivity of the material layer 104b, and the electrical conductivity of the material layer 104b is greater than the electrical conductivity of the material layer 104a Rate. In the electrode plate 100, due to the substrate area A and the power supply P rf The distance is the smallest, the electric field intensity of the substrate region A will be greater than the electric...

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Abstract

The invention relates to an electrode plate. The electrode plate comprises a base plate and a plurality of material layers, wherein the base plate is provided with a plurality of base plate regions, and each material layer has different electric conductivities. In the manufacturing method of the electrode plate, firstly the step of estimating the strength of an electric field is performed, in the step, a radio-frequency power supply is applied on the base plate so as to induce the electric field and plasma on the base plate; then the step of plating films on the material layers is performed, in the step, the material layers with different electric conductivities are plated on the base plate regions according to the strength of the electric field of each base plate region so that the strength of the electric field of all the base plate regions are equal.

Description

technical field [0001] The invention relates to an electrode plate, in particular to an electrode plate applied to plasma thin film deposition and etching technology. Background technique [0002] With the advancement of science and technology and the development of the economy, the semiconductor process technology is becoming more and more mature, which makes the semiconductor products smaller and smaller in size and more powerful in function. Existing semiconductor and optoelectronic processes usually include cleaning steps, heating steps, photolithography steps, etching steps, deposition steps, and cutting steps. The etching and deposition techniques used in the etching steps and deposition steps are closely related to the pass rate of semiconductor and optoelectronic products. Therefore, various etching and deposition technologies have been developed one after another, among which plasma etching technology and plasma thin film deposition technology are currently the most...

Claims

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Application Information

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IPC IPC(8): H01L21/00H05H1/46C23C16/44C23F4/00H01J37/32
Inventor 庄峻铭简永杰
Owner CONTREL TECH CO LTD