Thermal management device and method for making the same

Abstract

A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive / subtractive manufacturing processes such as ultrasonic consolidation.

Description

technical field [0001] The present disclosure relates generally to controlling thermal energy generated by a heat generating source, such as an electronic component, and in particular to devices for directing thermal energy away from the heat generating source, and methods of making the same. Background technique [0002] Many devices have been developed for removing heat away from thermal sources such as printed circuit boards (PCBs) to avoid adverse effects on heat sensitive components. In one form of these devices, discrete heat pipes are assembled between separate metal sheets. Heat generated by the electronic components is conducted through the metal sheet to the heat pipe, where the heat is carried away by the flow of heat transfer fluid. Another known device employs a layer of thermally conductive solid material, such as thermally conductive graphite, placed between two discrete sheets of material. Component heat is transferred from the component through the thermal...

AI Technical Summary

Problems solved by technology

[0003] Existing thermal control devices may require the integration of composite materials and multiple interfaces, often with adhesives in between, which have higher thermal resistance and can lead to poor thermal conductivity

Also, known thermal control devices can be relatively expensive to manufacture because more than one process is required to assemble and manufacture the individual parts

These design and constraints imposed by existing manufacturing techniques may limit design flexibility and result in suboptimal performance for some applications

Additionally, the relentless pursuit of higher loop densities and smaller component sizes may complicate the design of more efficient thermal control devices

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