Hydroxypropyl methyl cellulose hard capsules and process of manufacture
A technology of hydroxypropyl methylcellulose and hard capsules, applied in the field of hydroxypropyl methylcellulose hard capsules and preparation, can solve problems such as poor appearance quality and solubility properties
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Embodiment 1
[0099] Example 1: Aqueous composition for the manufacture of hydroxypropylmethylcellulose hard capsules
[0100] 5 kg of a composition of 18.8% HPMC type 2906 (28.7% methoxyl content, 5.4% hydroxypropoxyl content) with a viscosity of 4.4 cPs at 2% strength (w / w) was prepared as follows:
[0101] Under stirring, the HPMC powder was dispersed into hot water at 75 °C. Foam formation was observed. After powder dispersion was complete, the temperature was maintained at 75°C with very gentle stirring to defoam the dispersion. The dispersion was then cooled to 10° C. with gentle stirring to achieve dissolution of the HPMC. Holding the composition at 10° C. for more than 30 minutes, a ready dipping composition for capsule manufacture was obtained.
[0102] The gel temperature of the HPMC composition was determined by gradually heating the composition for viscosity measurement. The gelling temperature was found to be 34°C.
Embodiment 2
[0103] Embodiment 2: the manufacture of hard capsule
[0104] The composition prepared in Example 1 was poured into the dip pan of a pilot plant for hard capsule manufacture. Dip pins of size 0 were preheated at 75°C while maintaining the dipping composition at 32°C. At this temperature, the viscosity of the dipping composition is 2000 cPs. Size 0 capsules were made via the conventional dipping method but using preheated pins. After impregnation, the capsules were dried in an oven with hot air at 60°C and 40% RH for 3 minutes, followed by hot air at 40°C and 40% RH.
[0105] The obtained capsules are of high quality: good and standard size (top wall thickness > 140 μm), high transparency (similar to gelatin hard capsules), excellent dissolution and mechanical properties.
Embodiment 3
[0106] Example 3: Optimum preheating temperature for pins
[0107] Example 2 was repeated, but preheating the dipped pins at 60°C instead of 75°C. It should be noted that pin size 0 is considered a medium-large size.
[0108] After dipping, gelation on the pins is suboptimal to obtain commercially usable capsules. During drying, the solution partly flowed down the pin, resulting in a top wall thickness of less than 50 μm.
[0109] Conclusion: For the manufacture of size 0 capsules, 60°C is less preferable than 75°C as the pin preheating temperature.
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