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High-power LED oscillation package structure

A packaging structure, high-power technology, applied in the direction of electrical components, electrical solid-state devices, circuits, etc., can solve the problems of affecting LED drive efficiency, high LED chip junction temperature, and damaging the life of other components, and achieves a wide range of applications and environments. Effect of improving heat dissipation performance and extending service life

Inactive Publication Date: 2011-04-13
王海军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the heat dissipation performance is also an important technical indicator of LEDs. A large part of the above-mentioned energy conversion is released in the form of heat energy. Long-term use will cause the junction temperature of the LED chip to be too high, the decay speed will be accelerated, and the service life will be shortened; Moreover, the increase in temperature will also affect the driving efficiency of the LED and damage the life of other components inside the device.

Method used

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  • High-power LED oscillation package structure
  • High-power LED oscillation package structure
  • High-power LED oscillation package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 , figure 2 As shown, the upper surface of the substrate 1 is printed with two sets of ring-like copper pole lines, which are respectively the oscillating chip electrode 6 connected to the oscillating chip 5 and the LED chip electrode 7 connected to the LED chip 3. The two groups of electrodes The line is higher than the plane of the substrate 1 to form an annular oscillating space 9 that can accommodate the downward oscillation of the oscillating chip 5. The two ends of the oscillating chip 5 are bonded to the electrodes 6 of the oscillating chip through conductive glue, and are pressed by the bracket 2 to vibrate the chip. The oscillating space 9 between 5 and the substrate 1 is equipped with heat-conducting silver paste to facilitate the heat dissipation and heat sinking of the LED chip 3, the bracket 2 and the substrate 1 are glued and fixed, and the LED chip 3 is welded on the upper surface of the middle part of the oscillating chip 5 It is also c...

Embodiment 2

[0028] Vibration chip 5 among the present invention can also be two or more than two, as image 3 , Figure 4 As shown, the oscillating chip group is made up of two oscillating chips 5, and these two oscillating chips 5 are fixed on the upper surface of the substrate 1 and are parallel to each other. The two ends of the two ends are bonded to the copper electrode circuit by conductive glue, and are pressed by the bracket 2. The surface of the substrate 1 under the bracket 2 is concavely provided with an arc-shaped depression by molding or grinding to form a 5-way oscillating chip. The oscillating space 9 for the lower oscillating action, the oscillating space 9 is equipped with thermally conductive silver paste to facilitate the heat dissipation and heat sinking of the LED chip 3, the bracket 2 and the substrate 1 are glued and fixed, the LED chip 3 is fixed in the form of flip-chip, soldered on On the lower surface of the two oscillating chips 5, an electrical circuit is lai...

Embodiment 3

[0030] When the oscillating wafer 5 among the present invention is two or more than two, the oscillating wafer 5 can also intersect and be arranged, as Figure 5 As shown, the oscillating chip group is composed of two oscillating chips 5, the two oscillating chips 5 are fixed on the upper surface of the substrate 1 and intersect and fixed, and the LED chip 3 is welded and fixed on the upper surface of the intersection point of the two oscillating chips 5, All the other structures are the same as in the second embodiment.

[0031] In the present invention, the oscillating frequencies of the two or more oscillating chips 5 constituting the oscillating chip group can be the same or different, and can be combined according to requirements to adjust the oscillating frequency of the entire oscillating chip group.

[0032] In the present invention, the oscillating chip 5 can be made of crystal or ceramic material.

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Abstract

The invention relates to a high-powder LED oscillation package structure, which comprises a substrate, an oscillation crystal plate set, an LED chip, a bracket and a lens, wherein the oscillation crystal plate set comprises at least one oscillation crystal plate; the oscillation crystal plate is fixed on the upper surface of the substrate; an oscillation space is preserved between the oscillationcrystal plate and the upper surface of the substrate; the LED chip is fixed on the upper or lower surface of the middle part of the oscillation crystal plate; the substrate is provided with an oscillation crystal plate electrode and an LED chip electrode; the oscillation crystal plate electrode is connected with the oscillation crystal plate to be turned on; the LED chip electrode is connected with the LED chip to be turned on; the bracket presses the two ends of the oscillation crystal plate and is fixedly connected with the substrate; and the lens is fixedly arranged on the support. The invention is simple in structure, high in light emission efficiency, excellent in radiation performance, wide in application rang and long in service life.

Description

technical field [0001] The invention belongs to the technical field of photoelectric lighting, and in particular relates to a high-power LED oscillating packaging structure. Background technique [0002] At present, with the development of LED material epitaxy and chip technology, LED has shown a good application prospect, especially high-power LED, its application field has been continuously expanded, and has been widely used in landscape lighting, miner's lamp, street lamp, emergency lamp and other fields. [0003] LED is a special kind of diode. Its core part is a chip composed of P-type semiconductor and N-type semiconductor. These semiconductor materials are pre-implanted or doped to produce a P / N junction structure. In the N junction, the current in the LED can easily flow from the P pole to the N pole. Two different carriers, holes and electrons, flow from the electrodes to the P / N junction under different electrode voltages. When the holes and electrons meet When re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L33/00
Inventor 王海军
Owner 王海军