Method for designing microwave and millimeter-wave spatial power synthesis amplifier

Abstract

The invention discloses a method for designing a microwave and millimeter-wave spatial power synthesis amplifier. The design method determines the components of the power synthesis amplifier first comprising a power divider, a power amplifier and a power combiner, and then mainly introduces the design method of the power divider according to the characteristics and requirements of the prior art. The power divider is realized mainly by the following steps: a, designing a transition section from a microstrip to a substrate integrated waveguide; b, designing a transition section from the substrate integrated waveguide to a semi-mode substrate integrated waveguide; and c, designing a transition section from the semi-mode substrate integrated waveguide to the microstrip so as to form a multi-channel power divider. Based on the realization of the power divider, the power divider can be used as the power synthesizer by reversing the power divider according to the reversibility of a passive network. Compared with the prior art, the microwave and millimeter-wave spatial power combining amplifier adopts the planar structure design completely, and has the advantages of high combining efficiency, good heat sink performance, simple processing, low cost, high yield and the like.

Description

technical field [0001] The invention relates to a design method of a power synthesizing amplifier, in particular to a design method of a microwave and millimeter wave space power synthesizing amplifier of a substrate-integrated waveguide / half-mode substrate-integrated waveguide. Background technique [0002] In the field of microwave electronics, semiconductor power devices are highly valued due to their small size, light weight, long life, and low operating voltage, and are widely used in radar, electronic warfare, military communications and other equipment. The power of a single device is difficult to meet the requirements of high-power military electronic systems due to the limitation of physical mechanism and manufacturing process. To solve this problem, solid-state power combining technology has been studied. [0003] Since the mid-1970s, researches aimed at improving the output power of microwave and millimeter-wave solid-state power sources have been carried out in ...

AI Technical Summary

Problems solved by technology

The disadvantages are: narrow bandwidth, complex structure, difficult processing, three-dimensional structure, and insufficient output power

Its main disadvantages are: the working mode is complex, and the suppression of high-order modes is poor; when the number of synthesis channels increases, there is difficulty in heat dissipation; it is a three-dimensional structure, and as the frequency increases, the precision requirements for machining increase

Its main disadvantages are: it is a three-dimensional structure, the processing is complicated, and the cost is high; the design and debugging are complicated, and it is not suitable for mass production

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