Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor sealing resin composition and semiconductor device using the resin composition

A resin composition and sealing resin technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as damage to resin curability, and achieve the effect of excellent fluidity

Active Publication Date: 2010-02-03
SUMITOMO BAKELITE CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method often compromises the curability of the resin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor sealing resin composition and semiconductor device using the resin composition
  • Semiconductor sealing resin composition and semiconductor device using the resin composition
  • Semiconductor sealing resin composition and semiconductor device using the resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091]

Epoxy resin 1: phenol-aralkyl type epoxy resin (Nippon 7.57 parts by weight) with biphenylene structure

NC-3000 manufactured by Kayaku Co., Ltd., epoxy equivalent: 274; softening point: 58°C)

Compound B1 4.23 parts by weight

Curing accelerator 1: 0.20 parts by weight of triphenylphosphine

Silane coupling agent 1: 0.30 parts by weight of γ-glycidyl etheroxypropyl trimethoxysilane

0.20 parts by weight of 2,3-dihydroxynaphthalene

Fused spherical silica (average particle size: 30 μm) 87.00 parts by weight

Carnauba wax 0.20 parts by weight

Carbon black 0.30 parts by weight

The above ingredients were mixed using a mixer at room temperature. The mixture is melt-kneaded at 80° C. or more and 100° C. or less using a heating roll, cooled, and then pulverized, whereby an epoxy resin composition is obtained. The prepared epoxy resin compositions were evaluated by the following methods. The evaluation results are shown in Table 2.

[0092] Spiral flow: Transfer t...

Embodiment 2-24 and comparative example 1-3

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Softening pointaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Average lengthaaaaaaaaaa
Login to View More

Abstract

This invention provides a semiconductor sealing resin composition comprising a compound (A) containing two or more glycidyl ether groups and a curing agent. The semiconductor sealing resin compositionis characterized in that, when the ion viscosity is measured with the elapse of time under conditions of a measuring temperature of 175 C and a measuring frequency of 100 Hz with a dielectric analyzer, the appearance time of the lowest ion viscosity, the lowest ion viscosity, the maximum slope appearance time of the ion viscosity, and the maximum slope are not less than 5 sec and not more than 40sec from the start of the measurement, not less than 4.0 and not more than 7.0, not less than 10 sec and not more than 60 sec form the start of the measurement, and not less than 2.0 and not more than 6.0, respectively.

Description

technical field [0001] The present invention relates to a semiconductor sealing resin composition and a semiconductor device using the semiconductor sealing resin composition. Background technique [0002] In recent years, in the market trend of miniaturization, light weight and performance improvement of electronic devices, the integration level of semiconductor elements (hereinafter also referred to as "elements" or "chips") has increased year by year, accelerating the development of semiconductor devices (hereinafter also referred to as "chips"). Packages") the development of surface mounting (surface mounting). Therefore, the demand for a semiconductor sealing resin composition (hereinafter also referred to as "sealing material" or "sealing substance") has also become more urgent. In particular, in current typical surface mounting processes for semiconductor devices, when a semiconductor device that has absorbed water vapor is exposed to a high temperature environment d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08G59/62H01L23/29H01L23/31
CPCH01L2224/32245H01L2924/10253H01L24/45H01L2224/73265H01L2224/48247H01L2224/45144H01L2924/15747H01L24/73H01L2224/45H01L2224/45015H01L2224/48091H01L2924/1301H01L2924/14H01L2924/181
Inventor 黑田洋史
Owner SUMITOMO BAKELITE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com