Substrate floating device

Abstract

The present invention provides a substrate floating device. In the substrate floating device, the air with constant pressure is supplied to a floating plate with a simple structure. The substrate floating device (10) comprises the following components: a plurality of floating plates (11) which discharge the air used for floating the substrate; a buffer tank (12a) which temporarily stores the air supplied by the plurality of floating plates (11); and a plurality of air tubes (13) which respectively supply air for the plurality of floating plates (11) from the buffer tank (12a), wherein, the floating plates (11) are of rectangular tile shaped and are arranged with a matrix shape. The buffer tank (12a) is configured below the area used for configuring the plurality of floating plates (11), and extends along one direction in the arrangement directions (arrows D1 and D2) of the floating plates (11). The plurality of air tubes (13) connect the buffer tank (12a) with the plurality of floating plates (11) with a substantially same length.

Description

technical field [0001] The present invention relates to a substrate floating device for floating a substrate such as a liquid crystal display (LCD) or another flat panel display (FPD) with air. Background technique [0002] Conventionally, in the process of forming a photoresist pattern on a glass substrate (plain glass) through a photolithography process to manufacture a liquid crystal panel and the inspection process of inspecting the glass substrate, the following method is used: the plain glass substrate is made of air. The plain glass substrate in the non-contact state is lifted and inspected or transported (for example, refer to Patent Document 1). [0003] In the case of using air to float the plain glass substrate, a plurality of glass substrates formed with air discharge holes are arranged side by side on the upper surface of the table on which the glass substrate is placed or the conveying surface on which the glass substrate is conveyed in the substrate inspection...

AI Technical Summary

Problems solved by technology

That is, since the slack in the air piping increases by 200 mm from the farthest floating plate, it is necessary to guide the slack and elongated air piping, and there is a problem that the piping work is complicated

[0009] When the slack air pipe is rolled up on the side of the buffer tank, resistance to the flow of air is generated in the rolled up portion, so the pressure of the air flowing through each air pipe is different, and it is impossible to make each float The new problem of constant buoyancy pressure of the lifting board

[0010] In addition, since the length of all the air piping must correspond to the length of the air piping with the largest distance from the buffer tank to the floating plate, the pressure loss increases, and it is necessary to increase the pressure of the air supplied to the floating plate.

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