A kind of FPC manufacture method and FPC

Abstract

The present invention relates to a kind of FPC manufacturing method and FPC, and this method comprises the following steps: cover copper foil on the base material, and form circuit layer and welding pad area on copper foil, there are several welding pads in the welding pad area; The cover film of the film opening is pasted on the copper foil so that the opening of the cover film corresponds to the area of ​​the pad; the pad is subjected to immersion gold treatment; the silver paste is printed on the upper surface of the cover film; the PSR ink is printed on the surface of the silver paste and the base between the pads on the surface of the material. In the above method, after immersion gold, the silver paste is printed first, and then the PSR ink is printed. The PSR ink can achieve the effect of synchronous soldering between the pads and the silver paste. The production process is simple and the cost is low. The structure of the obtained FPC is Also simpler.

Description

technical field [0001] The invention relates to an FPC (Flexible Printed Circuit Board, flexible circuit board) and a manufacturing method thereof. Background technique [0002] FPC is the most complex and versatile type of circuit board products, especially because it has the characteristics of light and thin, bendable, low voltage, low power consumption, etc., it can be three-dimensional with the size and shape of the internal space of electronic products. Wiring, therefore, is widely used in electronic products such as notebook computers, LCD monitors, hard disks, printers and automobiles. [0003] In the FPC manufacturing process, the opening of the cover film is usually used to solve the problem of solder resistance between larger pads. Generally speaking, the bonding accuracy of the cover film requires a tolerance of more than 0.1mm, and the unilateral avoidance of 0.1mm means that a space of 0.2mm must be reserved. The stamping accuracy of the cover film mold is gene...

AI Technical Summary

Problems solved by technology

[0006] In the above method, in order to play the role of solder resist, it is also necessary to print a layer of solder resist ink 5 on the silver paste 4, the process is complicated, correspondingly, the efficiency is also low, and the cost is increased

On the other hand, due to the high fluidity of the printed silver paste 4 itself, part of the silver paste 4 will flow to the surface of the pad 6 and cause defects.

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