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Wind guiding cover

A technology of air guide cover and air duct, which is applied in the field of air guide cover, which can solve the problems of limited heat dissipation speed and dangerous working state of heating elements 15, and achieve the effects of increasing space, strengthening heat convection effect, and reducing wind resistance

Inactive Publication Date: 2010-02-17
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for the heating element 15, the top cover 10 and the two side walls 11 of the existing air guide cover 1 form a straight flow path, and when the air flow 160 passes through the inside of the air guide cover 1, it only dissipates heat through the flow channel. The heat dissipation speed is limited, so that the temperature of the heating element 15 exceeds the controllable range, so that the heating element 15 is in a dangerous working state

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0045] see Figure 2A and Figure 2B , is a schematic diagram of an embodiment of the wind guide cover of the present invention. The structure of the windshield shown in this embodiment and other embodiments is only illustrative, as long as it is applied to an electronic device with a heating element, including the heat exchange area, the opposite air inlet part and the air outlet part, in this The heat exchange area is provided with an air flow turbulence part, so that the air flow passes through the air flow turbulence part to form a disturbance, all of which are applicable to the present invention.

[0046] Such as Figure 2A As shown, in this embodiment, the air guide cover 2 is a bottomless cover body composed of a top cover 2a and two side walls 2b extending downward along two opposite sides of the top cover 2a, and each of the side walls 2b can be It is integrally formed on the top cover 2a.

[0047] The wind guide cover 2 includes: a heat exchange area 20, a relati...

no. 2 example

[0055] see image 3 The difference between this embodiment and the first embodiment lies in the structure of the heat exchange area 20, and the design of the other related air guide covers 2 is substantially the same, therefore, the same elements and corresponding descriptions will be omitted, and will not be repeated, hereby stated.

[0056] As shown in the figure, when the air flow turbulence part 200' of the heat exchange area 20 has two V-shaped folded edge structures, the degree of turbulent flow formed by the cold air flow 50 is increased to increase the heat dissipation effect (described later); and it can be Make the lengths and inclination angles of the two first inclined surfaces 200a, 200a' different or the same, and / or the lengths and inclination angles of the two second inclined surfaces 200b, 200b' be different or the same; of course, in other embodiments , the concave fold length, slope angle, and concave fold depth of each of the V-shaped hem structures can be...

no. 3 example

[0059] see Figure 4 The difference between the present embodiment and the second embodiment lies in the structure of the air inlet portion 21', and the design of the other related wind guide covers 2 is substantially the same, therefore, the same elements and corresponding descriptions will be omitted, and will not be described again. It is hereby stated.

[0060] As shown in the figure, when the height of the fan module 5 is relatively high relative to the heat source, the height of the air inlet 210 of the air guide cover 2 is also relatively high. The pressure part 211 is provided between the air inlet 210 and the heat exchange area 20, so that the cold air flow 50 generated by the fan module 5 is pressed down and concentrated on the heat exchange area 20, so that the flow velocity of the cold air flow 50 is increased; In the embodiment, the airflow depressing part 211 is a downward inclined surface and is connected to the first inclined surface 200a of the airflow turbul...

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Abstract

The invention discloses a wind guiding cover, which comprises a wind inlet part provided with a wind inlet, a wind outlet part provided with a wind outlet opposite to the wind inlet, and a heat exchange area arranged between the wind inlet and the wind outlet. The heat exchange area is provided with an airflow turbulence part close to the wind inlet part. When the wind guiding cover covers a heating element of a main plate, the wind guiding cover and the main plate form a wind passage; and the heat exchange area is positioned above the heating element so that the airflow passes through the airflow turbulence part to increase airflow turbulence so as to reinforce the heat convection effect and increase the convection heat exchange coefficient.

Description

technical field [0001] The invention relates to a heat dissipation technology, in particular to a wind guide cover applied to an electronic device. Background technique [0002] The electronic devices currently used in the market often cause the internal temperature of the electronic device to rise due to frequent use and long operation time, which easily affects the normal operation of the electronic device. At the same time, due to the heating elements contained in the electronic device, such as the central processing unit (Central processing unit, CPU), memory, north bridge chip, and power supply, etc., the computing speed that can be achieved is getting faster and faster, and the data processing capacity is also multiplying. Increase, therefore, often due to high operating temperature and cause failures. In order to prevent the heating element from malfunctioning due to overheating, the current solution in the industry is to install a cooling fan in the electronic devic...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20H01L23/467
Inventor 田文斌郑再魁
Owner INVENTEC CORP
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