Micro-pit array-processing method based on laser impact effect

A micro-pit array, laser shock technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effect of controllable area, improved anti-wear ability, and improved anti-friction performance

Inactive Publication Date: 2010-02-24
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, none of the above technologies utilize laser impact force to realize the processing of the micro-pit structure on the surface of the workpiece through local plastic deformation.

Method used

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  • Micro-pit array-processing method based on laser impact effect
  • Micro-pit array-processing method based on laser impact effect

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Embodiment Construction

[0016] The following is a detailed description of the embodiments of the present invention. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0017] Such as figure 1 As shown, it is the working environment of this embodiment, wherein: high-energy short-pulse laser 1, laser beam 2, external optical path system 3, water flow nozzle 6, absorption layer 7, workbench 9, workpiece fixture 10, constraining layer 11, control system 12 compositions. The external optical path system 3 includes a mirror 4 and a focusing lens 5 .

[0018] This embodiment implements in the following ways:

[0019] In the first step, the absorbing layer 7 is attached to the surface of the workpiece 8 to absorb laser energy to generate steam and protect the workpiece fr...

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Abstract

The invention relates to a micro-pit array-processing method based on laser impact effect, belonging to the technical field of laser processing. The method comprises the following steps: attaching anabsorption layer on the surface of a working piece to be processed; mounting the working piece on a worktable; applying a restraint layer on the absorption layer; and starting a laser to output a beamto impact the working piece so as to generate a plurality of impact points on the surface of the working piece to be processed and realize the laser impact processing of a micro-pit array. The methodadopts the high-energy short-pulse laser to act on an energy source and has simple, reliable and easily automated technological method and strong controllability of a technological process. Comparedwith a traditional laser-boning process, the technological method does not thermally influence the surface of the working piece, generates residential stress on the surface of the working piece, ensures and improves the abrasion-resistant performance of the working piece and is especially suitable for processing a micro-pit array on a friction secondary surface.

Description

technical field [0001] The invention relates to a method in the technical field of laser processing, in particular to a method for processing micro-pit arrays based on the laser shock effect. Background technique [0002] As an effective way to improve sliding friction performance, the surface structure of dimple arrays has been increasingly applied to various types of friction pair surfaces. These micropits are independent of each other, do not penetrate each other, have the same depth, and are distributed on the surface according to certain rules. They can store lubricating oil and play a role in maintaining the pressure of the oil film, so that the contact surface around each micropit unit forms a lubricating oil film, which can effectively Reduce friction coefficient, increase lubrication and reduce friction. [0003] In the prior art, there are "ultrasonic processing method of surface micro-pits", invention patent number: 00117761.3; "method and device for numerically ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D26/06B23K26/00
Inventor 姚振强胡永祥
Owner SHANGHAI JIAO TONG UNIV
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