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Spray head positioning device and spray head positioning method

A technology of positioning device and nozzle, applied in the direction of photosensitive material processing, etc., can solve the problems of crystal edge cleaning cannot be effectively completed, difficult to measure, bad angle and so on

Inactive Publication Date: 2012-06-27
HEJIAN TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the angle is prone to abnormalities and is difficult to measure, sometimes a bad angle will be formed, so that the cleaning of the crystal edge cannot be completed effectively, the cleaning effect will not increase, and wafer abnormalities will occur.
Currently, there is no corresponding tool to adjust this angle

Method used

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  • Spray head positioning device and spray head positioning method
  • Spray head positioning device and spray head positioning method
  • Spray head positioning device and spray head positioning method

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Embodiment Construction

[0026] A nozzle positioning device according to the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] The schematic diagram of the crystal edge photoresist cleaning structure of a preferred embodiment of the present invention is as follows figure 2 shown. First, the structure of EBR is the same as figure 1 The same as in the above, the crystal edge 13 is located on the wafer cleaning table, the shower head 12 extends above the wafer, and forms a certain angle with the wafer, and the peripheral device 13 is around the wafer cleaning table.

[0028] A nozzle positioning device 21 of a preferred embodiment of the present invention, the nozzle positioning device 21 is a polyhedron, preferably a trapezoidal cube as shown in the figure, of course it can also be a cube of other shapes, as long as it has a The first surface on the wafer is enough, the second surface is opposite to the first s...

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Abstract

The invention provides a spray head positioning device and a spray head positioning method. The spray head positioning device is of a polyhedron, and the polyhedron is provided with a first surface which is arranged on a wafer to be cleaned, and a second surface opposite to the first surface; the second surface is provided with at least one groove for placing and positioning a spray head; and theangle of the groove is the one required for the spray head. The device has the advantages of having simple structure, small volume and high accuracy, and reducing product abnormity caused by an abnormal light-resistant wafer edge cleaning angle.

Description

technical field [0001] The invention relates to a wafer cleaning device, in particular to a nozzle positioning device and a positioning method. Background technique [0002] In the current semiconductor industry, photoresist coating is one of the commonly used and necessary technologies. At present, the industry usually uses the method of spin coating to coat the photoresist, and the photoresist coating is also carried out in two ways: spin coating or vapor phase coating, that is, the photoresist is dripped on the surface of the high-speed rotating chip , use the centrifugal force during rotation to move the photoresist to the periphery of the chip and finally form a layer of photoresist with uniform thickness. Phenomenon, forming residues, which may cause problems such as machine errors. At the same time, since the wafer may also have particle defects during the transfer process, the above-mentioned particles may affect the yield of the wafer in the subsequent process. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/42
Inventor 胡珂陈耀王波韩立斌
Owner HEJIAN TECH SUZHOU