Integrated coaxial dielectric voltage controlled oscillator and manufacturing method thereof

Abstract

The invention relates to an integrated coaxial medium voltage controlled oscillator and a manufacturing method thereof. The oscillator comprises a coaxial dielectric resonator, a tuning circuit, an oscillating circuit, an attenuation circuit and an amplifying circuit; the coaxial dielectric resonator is welded on a tube seat through welding technology, and other circuits are made on a ceramic substrate which is mounted on a tube casing; the circuits and the elements adopt gold wire bonding; and finally the coaxial dielectric resonator and the circuits are integrated in a fully sealed metal tube casing. In the invention, the attenuation circuit and a buffer amplifying circuit are added behind a voltage controlled resonator circuit, so that the isolation of the oscillator and a load is increased and the loaded capacity of the oscillator is improved; the ceramic circuit substrate and a bare tube core element are adopted and the resistor and inductor elements are made by adopting a film technique, so that the circuit volume is reduced and the integration of the circuits is improved; and the fully sealed metal tube casing is adopted for packaging, so that the environmental suitability is high.

Description

technical field [0001] The invention relates to an integrated coaxial medium voltage-controlled oscillator and a manufacturing method thereof. Background technique [0002] The coaxial dielectric voltage controlled oscillator has the characteristics of low phase noise and good temperature stability, and is widely used in the field of communication electronics. Existing coaxial dielectric resonators are all manufactured by surface silver-plating process, and their installation is done by soldering. Therefore, most of the voltage-controlled oscillators made of it use PCB circuit boards, and the oscillation circuit uses discrete components. accomplish. Due to the use of a large number of plastic-encapsulated components, this kind of circuit is generally large in size and low in integration. It only includes an oscillating circuit, which makes the circuit more sensitive to the load and poor in stability; and due to the limitations of the PCB process itself, it is impossible to ...

AI Technical Summary

Problems solved by technology

Due to the use of a large number of plastic-encapsulated components, this kind of circuit is generally large in size and low in integration. It only includes an oscillating circuit, which makes the circuit more sensitive to the load and poor in stability; and due to the limitations of the PCB process itself, it is impossible to achieve full sealing. Adaptability to the environment is also poor

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