Polishing device and method of sapphire

A polishing device, sapphire technology, applied in grinding/polishing equipment, machine tools suitable for grinding workpiece edges, grinding machines, etc., can solve the problems of difficult to obtain high-quality optical surfaces, low polishing efficiency and yield, subsurface cracks, etc. problems, to achieve low surface roughness, small thermal impact, and excellent performance

Inactive Publication Date: 2011-11-09
GUANGDONG UNIV OF TECH
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, sapphire is mainly processed by mechanical polishing, chemical mechanical polishing and other methods. These traditional contact polishing methods often cause problems such as brittle failure during the material removal process. After polishing, there are often surface scratches, pits and so on on the surface of sapphire. Defects such as subsurface cracks, polishing fog spots may also appear on the chemically polished surface, it is difficult to obtain a high-quality optical surface, and the polishing efficiency and yield are low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing device and method of sapphire
  • Polishing device and method of sapphire
  • Polishing device and method of sapphire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0023] The structural representation of the sapphire polishing device of the present invention is as figure 1 As shown, it includes a laser beam 1, a support plate 4, a workbench 6, a stepper motor 7 that drives the workbench 6 to move in the X direction, a stepper motor 8 that drives the workbench 6 to move in the Y direction, and a connecting piece 9, wherein The workbench 6 is equipped with a stepper motor 7 for driving it to move in the X direction and a stepper motor 8 for driving it to move in the Y direction, the connecting piece 9 is fixed on the workbench 6, and the support plate 4 is installed on the connecting piece 9 , the sapphire wafer 2 to be polished is fixed on the support plate 4, the laser beam 1 is radiated from the top of the sapphire wafer 2 to be polished to the sapphire wafer 2, and the stepping motor 7 and the drive worktable are driven by the workbench 6 to move in the X direction 6 The stepping motors 8 moving in the Y direction are all connected wit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to polishing device and method of sapphire. The polishing device comprises a laser beam, a shoe plate, a worktable and a connecting piece, wherein the worktable is provided with a stepper motor driving the worktable to make X-direction movement and a stepper motor driving the worktable to make Y-direction movement, the connecting piece is fixed on the worktable, the shoe plate is arranged on the connecting piece, and a sapphire wafer to be polished is fixed on the shoe plate; the laser beam radiates to the sapphire wafer from the upward side of the sapphire wafer to be polished, and the stepper motor driving the worktable to make the X-direction movement and the stepper motor driving the worktable to make the Y-direction movement are respectively connected with a control device. The invention controls the X-direction movement and the Y-direction movement of a workpiece and the movement track of the workpiece relative to the laser beam by regulating the incident angle of the laser beam and controlling the worktable, thereby realizing the comprehensive scanning and polishing on the surface of the sapphire wafer. The invention can remove very little material, reduce and even eliminate the influence of heat on the sapphire material, thereby obtaining a polished surface with low surface roughness and low subsurface injury degree.

Description

technical field [0001] The invention relates to a sapphire polishing device and a polishing method thereof, in particular to a polishing device and a polishing method for polishing a sapphire wafer with an ultraviolet laser, and belongs to the innovative technology of a sapphire polishing device and a polishing method thereof. Background technique [0002] Sapphire single crystal is an excellent multifunctional material with the characteristics of high hardness, high melting point, good light transmission, excellent electrical insulation, and stable chemical properties. In terms of optics, sapphire single crystal is used in the mirror window of high-energy lasers due to its good light transmission and wear resistance. At the same time, it is also one of the key materials for infrared guided weapons. In terms of electronics, it can be used as a substrate for heteroepitaxial growth of semiconductor materials or metal materials, such as epitaxial substrates for semiconductor si...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B24B9/16
Inventor 魏昕谢小柱胡伟郭晓艳谢昕黄加福
Owner GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products