Front opening type wafer box with elliptic latch structure

Abstract

The invention relates to a front opening type wafer box which mainly comprises a box body and a door body, wherein the inside of the box body is provided with a plurality of slots used for containinga plurality of wafers, and an opening used for the input and the output of the wafers is formed at one side face of the box body. The door body is provided with an external surface and an internal surface. The door body is combined with the opening of the box body by the internal surface and used for protecting the wafers arranged inside the box body. The front opening type wafer box is characterized in that the inside of the door body is configured with at least one latch structure which comprises an elliptic cam, a pair of slide devices, at least one pulley and at least one positioning spring piece, wherein the slide devices contacting with both ends of the elliptic cam, the pulley is configured inside the door body and embedded into sliding chutes of the slide devices, and the positioning spring piece and the slide devices are connected into a whole.

Description

technical field [0001] The present invention relates to a front-loading wafer cassette, in particular to a latch structure (Latch) disposed inside the door body of the front-loading wafer cassette. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of the wafers and avoid external contamination, a sealed container is often used for automatic equipment transportation. Please refer to figure 1 Shown, is the wafer cassette schematic diagram of known technology. This wafer box is a front opening unified pod (FOUP), which has a box body 10 and a door body 20. There are a plurality of slots 11 inside the box body 10 to accommodate a plurality of pods horizontally. and a side surface of the box body 10 has an opening 12 for loading and unloading of the wafers, and the door body 20 has an outer surface 21 and an...

AI Technical Summary

Problems solved by technology

However, this method similar to lateral traction tends to generate an offset force in the moving direction of the movable pin 231, which will cause it to fail to be inserted into the socket of the box body 10, so that the box body 10 and the door body 20 cannot be connected. cover

At the same time, it will also increase the manufacturing cost of the front-opening wafer cassette

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