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Light-emitting diode lighting device and manufacturing method thereof

A technology for light-emitting diodes and lighting devices, which can be applied to lighting devices, cooling/heating devices for lighting devices, lighting and heating equipment, etc., and can solve problems such as inability to solve the problem of heat dissipation of high-power LEDs, limited efficacy, and limitations.

Inactive Publication Date: 2010-03-31
郭贵美
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the metal substrate 13 in the prior art has a limited effect of guiding the heat source to the heat dissipation element 14, and the contact area between the heat dissipation element 14 and the outside atmosphere is limited by the size of the heat dissipation hole 16, which still cannot solve the problem of high-power LEDs as a whole. cooling problem

Method used

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  • Light-emitting diode lighting device and manufacturing method thereof
  • Light-emitting diode lighting device and manufacturing method thereof
  • Light-emitting diode lighting device and manufacturing method thereof

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Embodiment Construction

[0046] Since the present invention discloses an LED lighting device and its manufacturing method, and the light-emitting principle of the LED used therein has been understood by those with ordinary knowledge in the relevant technical field, a complete description will not be given in the following description. At the same time, the drawings compared in the following are schematic structural representations related to the features of the present invention, and are not and need not be completely drawn according to the actual size, and are described first.

[0047] First please refer to Figure 2A-Figure 2B , which is the first preferred embodiment proposed by the present invention, is a plan view and an exploded view of an LED lighting device. The LED lighting device 20 includes an LED module 21, a vapor chamber 22 and a heat dissipation module 23, wherein the LED module 21 further includes a plurality of LEDs 210, and the vapor chamber 22 includes a composite substrate 24 and ...

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Abstract

The invention provides a light-emitting diode (LED) lighting device and a manufacturing method thereof. The LED lighting device comprises an LED module which comprises a plurality of LEDs, a steam cavity which is formed by a composite base plate and a cover part which is arranged in opposite to the composite base plate, and a heat dissipation module which is provided with a plurality of heat dissipation parts, wherein, the interior of the steam cavity maintains a vacuum state so as to be filled with working fluid; and the composite base plate further comprises an upper metal layer, an insulation layer and a lower metal layer, wherein, the upper metal layer is provided with a plurality of wick structures of lug bosses to form an interior evaporation surface of the steam cavity, while the lower metal layer is provided with a circuit electrically connected with the LED module.

Description

technical field [0001] The invention relates to a light-emitting diode lighting device and a manufacturing method thereof, in particular to a light-emitting diode lighting device with a vapor cavity and a manufacturing method thereof. Background technique [0002] Light emitting diodes (LEDs for short) are used for lighting, and forward current is applied through the semiconductor P-N interface to emit visible light, infrared light or ultraviolet light. Compared with traditional light sources such as incandescent tungsten bulbs or fluorescent lamps, LED light sources have the biggest advantage of being energy-saving and environmentally friendly. However, the semiconductor P-N interface working area of ​​the LED is small, so that the heat per unit area is very large, and the hot spot (hot spot) formed in this way is easy to cause the working temperature of the LED to rise rapidly. As a result, the luminous intensity of the LED decreases, the dominant wavelength of the lumine...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00H01L23/467F21Y101/02F21V29/508F21V29/71F21Y115/10
CPCH01L2924/0002
Inventor 郭贵美
Owner 郭贵美