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Polishing apparatus and polishing method

A technology for grinding devices and components, which can be used in grinding machines, belt grinders, grinding/polishing equipment, etc., and can solve the problems of larger reels, unstable grinding process, and larger influence of substrates.

Active Publication Date: 2010-03-31
KIOXIA CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, the following problems arise: the grinding pressure of the boundary portion becomes high, the grinding pressure of the central portion located in the middle of these boundary portions becomes low, and the central portion is difficult to be ground
However, when the base material of the abrasive tape becomes thicker, the reel for supplying and winding the abrasive tape becomes larger
And, when the base material of the polishing tape becomes thicker, the influence of the stretching of the polishing tape on the polishing of the substrate becomes larger, and the polishing process becomes unstable.

Method used

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  • Polishing apparatus and polishing method
  • Polishing apparatus and polishing method

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0080] In this experiment, the influence of the thickness of the hard part on the grinding results was investigated.

[0081] The experiment was performed under the following conditions.

[0082] The diameter of the abrasive grain (diamond grain) of the grinding tape: 5 μm (#4000)

[0083] The thickness of the base material of the abrasive belt: 25 μm

[0084] Hard parts: PET

[0085] Elastic parts: silicon sponge hardness 30 degrees

[0086] Under the above-mentioned conditions, experiments were performed by changing the thickness of the hard member within a range from 25 μm to 100 μm. According to the experimental results, when the thickness of the hard part is the thinnest 25 μm, the boundary part is ground faster than the central part, and as the hard part becomes thicker, the central part of the groove part becomes easier to be ground. grind. On the other hand, when the hard member becomes thicker, the contact area of ​​the polishing tape with the wafer W becomes sma...

experiment example 2

[0090] In this experiment, the influence of the diameter of the abrasive grain of a grinding|polishing belt on a grinding|polishing result was investigated. Specifically, in Experimental Example 1, an experiment was conducted using a polishing tape with an abrasive grain diameter of 0.2 μm (#10000) and a base material thickness of 50 μm under the condition that both the polishing position controllability and the polishing speed gave good polishing results. As a result, it was confirmed that the polishing position controllability decreased. This is because when the diameter of the abrasive grains of the polishing tape is small, the polishing force becomes low, and the polishing surface of the polishing tape cannot reach the central portion. On the other hand, as in Experimental Example 1, when the diameter of the abrasive grains of the grinding belt is large, the grinding force is high, so even if the grinding surface of the grinding belt is only in contact with the boundary po...

experiment example 3

[0093] In this experiment, the influence of the hardness of the elastic member on the grinding result was investigated. Specifically, a polishing tape having an abrasive particle diameter of 0.2 μm (#10000) and a substrate thickness of 50 μm was used, and a PVC sheet with a thickness of 0.5 mm was used as a hard member. In addition, experiments were performed by changing the hardness and structure of the elastic member. That is, the sponge with a hardness of 30 degrees ( figure 1 5), a sponge with a hardness of 10 degrees (the method in Fig. 15), an elastic member filled with pure water (the method in Fig. 18), and an elastic member of the airbag type in which pressurized air is enclosed (the method in Fig. 19) , used as an elastic component for experiments.

[0094] As a result, changing the hardness of the sponge from 30 degrees to 10 degrees makes it easier for the hard member to follow the circumferential direction of the wafer, so the polishing rate increases. The ela...

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Abstract

A polishing apparatus is provided with a substrate holding section (32) for holding and rotating a substrate (W); a pressurizing pad (50) for pressing the polishing surface of a polishing tape (41) tothe bevel section of the substrate held by the substrate holding section; and a feeding mechanism (45) for advancing the polishing tape in the longitudinal direction of the tape. The pressurizing pad(50) is provided with a hard member (51) having a pressing surface (51a) for pressing the bevel section of the substrate through the polishing tape; and at least one elastic member (53) for pressingthe hard member to the bevel section of the substrate through the polishing tape.

Description

technical field [0001] The present invention relates to a polishing device using a polishing tape, and more particularly to a polishing device and a polishing method for polishing a groove portion of a substrate such as a semiconductor wafer. Background technique [0002] In recent years, attention has been paid to the management of the surface state of the groove portion of the semiconductor wafer from the viewpoint of improving the yield in semiconductor manufacturing. Since a large amount of material is formed and laminated on a semiconductor wafer, unnecessary substances or damage remain on the groove portion that does not become an actual product. As a method of transporting and holding wafers, in the past, a holding member (such as a robot) was generally used to touch the back of the wafer. However, with the refinement of equipment and the mainstream use of wafers with a diameter of 300 mm, the cleanliness of the back is required. In recent years, A method of transfer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B21/08B24B9/00B24B21/16H01L21/304
CPCB24B9/065B24B21/002H01L21/02021
Inventor 福岛大重田厚高桥圭瑞伊藤贤也关正也草宏明
Owner KIOXIA CORP
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