Full-automatic ball attachment machine

Abstract

The invention discloses a full-automatic ball attachment machine, which comprises a workbench, a conveying chain arranged on the workbench, a solder ball storage disk, a flux paste dropwise-adding device which adds flux paste dropwise on substrates to be machined, and a solder ball placement device which places solder balls on the substrates to be machined. In the full-automatic ball attachment machine, the flux paste is directly injected into mounting holes of the substrates to be machined through a plurality of flux paste injection tubes on a dispensing mould, and the solder balls are placed into the mounting holes of the substrates to be machined through a plurality of vacuum ball absorption tubes on a ball attachment mould, so a plurality of substrates to be machined can be dispensed and placed once, positioning accuracy is high, raw materials are saved and production cost is reduced; and a whole power source is controlled by a PLC controller, thus the degree of automation is higher and operations are more convenient.

Description

technical field [0001] The invention relates to a welding processing equipment for a substrate to be processed, in particular to a fully automatic ball planting machine for dispensing glue into holes of a circuit substrate and planting balls. Background technique [0002] The substrate to be processed is mainly made by bonding the ball with solder paste, and welding the electrical components on the circuit board to be processed by melting the ball. Glue dispensing and ball planting are two important processes for processing the substrate to be processed, and the accuracy and efficiency of glue dispensing and ball planting will seriously affect the subsequent processing procedures. [0003] In the prior art, the dispensing process is to lay the prepared template on the substrate to be processed, so that the pre-designed holes on the template correspond to the electrical component installation holes on the processed substrate, and then brush a layer on the template. Soldering...

AI Technical Summary

Problems solved by technology

Adopting above-mentioned procedure to carry out dispensing and planting ball on the substrate to be processed mainly has the following deficiencies: one, adopt to brush soldering paste on the template, only a part of soldering paste enters in the electric component installation hole on the substrate, causes another Part of the soldering paste is wasted, so the consumption of soldering paste is large and the production cost is high; 2. The solder balls are planted one by one by using a metal ball blanking device to align with the electrical component installation holes on the substrate to be processed. Not only the ball planting efficiency is low, but also the placement After placing a solder ball, the blanking tube needs to move a position, so there is a certain displacement deviation, which seriously affects the accuracy of the subsequent soldering position; 3. Because the dispensing is manually operated, the solder balls are placed one by one, so each The processing time of the station is long, which seriously affects the processing progress of the subsequent substrates, resulting in low production efficiency and high production costs for the substrates to be processed.

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