Silicon wafer cross-connecting device and silicon wafer cross-connecting method thereof

Abstract

The invention provides a silicon wafer cross-connecting device and a silicon wafer cross-connecting method thereof. The device comprises a silicon wafer platform and a base platform bearing the silicon wafer platform, as well as a silicon wafer receiving hand, wherein the base platform is provided with a silicon wafer cross-connecting region; the silicon wafer receiving hand is built in the base platform and positioned below the silicon wafer cross-connecting region; the silicon wafer receiving hand comprises a plurality of telescopic vacuum columns; through holes which correspond to the positions of the telescopic vacuum columns are formed on the surface of the silicon wafer cross-connecting region; and a plurality of column holes are formed in the silicon wafer platform for leading the telescopic vacuum columns to penetrate through. When in cross-connection of silicon wafers, the silicon wafer platform is positioned in the silicon wafer cross-connecting region, the telescopic vacuumcolumns penetrate the through holes of the silicon wafer cross-connecting region and then continuously extend upward from the column holes of the silicon wafer platform till contacting the silicon wafers on the silicon wafer platform, vacuum is started for absorbing the silicon wafers to increase the silicon wafers to a certain height, and a transmission mechanical hand connects the silicon wafers from the vacuum columns. The cross-connecting device is conductive to reducing the vertical dimension and the quality of the silicon wafer platform and improving the motion speed and the synchronousmotion precision of the silicon wafer platform.

Description

technical field [0001] The invention relates to a silicon wafer stage system in semiconductor equipment, in particular to a silicon wafer transfer device and a silicon wafer transfer method in the silicon wafer stage system. Background technique [0002] With the increasing precision of semiconductor technology and the continuous expansion of productivity requirements, the automation requirements of semiconductor manufacturing equipment are also increasing. The silicon wafer transmission system in semiconductor equipment usually uses the transmission manipulator to directly transfer to the silicon wafer stage, and the silicon wafer is carried by the silicon wafer stage to complete the related semiconductor process. Taking the lithography equipment used to complete the lithography process as an example, the silicon wafer stage in the lithography equipment receives silicon wafers directly from the transfer manipulator, and then the silicon wafer stage carries the silicon wafer...

AI Technical Summary

Problems solved by technology

[0005] The problem solved by the present invention is that the vertical size and mass of the silicon wafer table with the traditional built-in vacuum splicing hand are large, which affects the movement speed and synchronous motion accuracy of the silicon wafer table

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