Surface processing method of large-size sputtering target material

A sputtering target and surface treatment technology, applied in milling machine equipment details, metal processing mechanical parts, maintenance and safety accessories, etc., can solve the problems of low liquid penetration efficiency, weak penetration ability, poor heat dissipation and lubrication effect, etc. , to improve the effect of heat dissipation and lubrication

Active Publication Date: 2010-05-12
广东江丰电子材料有限公司
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Problems solved by technology

[0008] The technical problem to be solved by the present invention is: in the surface treatment technology of the existing large-scale sputtering target material, ordinary cutting fluid is used to infiltrate in the form of liquid penetration during cutting, the liquid penetration efficiency is low, and the penetration ability is not strong. The heat dissipation and lubrication effects are not good, and the surface flatness and finish of the sputtering target are poor

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  • Surface processing method of large-size sputtering target material
  • Surface processing method of large-size sputtering target material
  • Surface processing method of large-size sputtering target material

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Embodiment Construction

[0021] The inventors of the present invention found that in the existing large-size sputtering target surface treatment technology, if ordinary cutting fluid is used to infiltrate in the form of liquid penetration during cutting, its penetration ability is not strong, resulting in poor heat dissipation and lubrication effects , the surface flatness and smoothness of the sputtering target are poor.

[0022] In view of this, the present invention provides a surface treatment method for a large-size sputtering target, the method comprising: providing a large-size sputtering target, the sputtering target being aluminum or an aluminum alloy; The surface of the target is milled, and vaporized alcohol is used for cooling during the milling process. Utilizing the volatility of alcohol and infiltrating with vaporized vapor-liquid two-phase fluid, it has a better heat dissipation effect and improves the surface smoothness and smoothness of the sputtering target.

[0023] refer to figu...

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Abstract

The invention provides a surface processing method of a large-size sputtering target material. The method comprises the following steps of: providing a large-size sputtering target material which is made of aluminum or aluminum alloy; milling the surface of the sputtering target material; and adopting vaporized alcohol to cool in the process of milling. Compared with the prior art, by adopting the vaporized alcohol to cool, the method ensures that gas phase and liquid phase fluids formed after the vaporization of the alcohol can have good cooling and lubricating effects so as to improve the surface evenness and finish of the sputtering target material in the process of milling.

Description

technical field [0001] The invention relates to the field of target material manufacturing, in particular to a surface treatment method for large-size sputtering target materials. Background technique [0002] Physical Vapor Deposition (Physical Vapor Deposition; PVD) is one of the most critical processes in the production process of semiconductor chips and TFT-LCD. Liquid Crystal Display; TFT-LCD) equipment and thin-film solar cells are one of the most important raw materials in the manufacturing process, among which ultra-high-purity aluminum and ultra-high-purity aluminum alloy sputtering targets are the most used. [0003] In order to meet the requirements of sputtering, the flatness and smoothness of the sputtering target surface must be very high, such as no scratches, no pits, etc. The flatness and smoothness of the sputtering target surface are an important guarantee for the stable quality of the coated film . [0004] Taking the commonly used large-sized aluminum ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23C3/13B23Q11/10
Inventor 姚力军潘杰王学泽鲍伟江刘庆
Owner 广东江丰电子材料有限公司
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