Monitoring low-resistance module grounding device

A grounding device and low-resistance technology, applied in the field of low-resistance module grounding devices that can be monitored, can solve the problems of reduced grounding grid performance, heavy workload, and high cost, and can reduce grounding resistance, ensure reliability, and be easy to install. Effect

Inactive Publication Date: 2010-06-09
吕良
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods are labor-intensive, time-consuming, difficult to construct, and costly. Moreover, due to the corrosiveness of the soil and the resistance reducing agent, the grounding body is easily corroded, which reduces the performance of the grounding grid and shortens the service life.

Method used

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  • Monitoring low-resistance module grounding device
  • Monitoring low-resistance module grounding device
  • Monitoring low-resistance module grounding device

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Embodiment Construction

[0015] Further illustrate the present invention below in conjunction with accompanying drawing.

[0016] figure 1 , 2 As shown, the equipment support 7 is connected to the grounding body through the grounding down conductor 8, and the grounding body includes several horizontal grounding pipes 4 connected in sequence and several vertical grounding pipes 5 connected with the horizontal grounding pipes 4 respectively. The above-mentioned grounding pipes all use metal pipes or composite pipes with high conductivity as conductors, and a number of seepage holes 6 are provided on the horizontal grounding pipe 4 and the vertical grounding pipe 5 . Use tee 1, cross, elbow 3, straight 2 and other pipe fittings of the same material to arbitrarily combine into various forms of hollow pipe grounding grids according to different requirements, and implant them underground at a depth of 0.8-3.0m.

[0017] The liquid storage tank 10 for holding the liquid communicates with the above-mentione...

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Abstract

The invention discloses a monitoring low-resistance module grounding device, which comprises a grounding body connected with a grounding downlead (8) and a liquid tank (10) for containing liquid, wherein the grounding body comprises a plurality of sequentially communicated horizontal grounding tubes (4) and a plurality of vertical grounding tubes (5) communicated with the horizontal grounding tubes (4) respectively; both the horizontal grounding pipes (4) and the vertical grounding pipes (5) are provided with a plurality of seepage holes (6); and the liquid tank (10) is communicated with the grounding pipes through liquid injection pipes (9). Cathode protection electrolyte is filled in the grounding pipes and seeps into soil through the seepage holes (6) to keep the soil wet constantly and increase the free ions in the soil. The device has the advantages of obviously reducing grounding resistance and effectively ensuring the reliability of a grounding network. Particularly in areas and seasons of high soil resistance and he device has obvious effects.

Description

technical field [0001] The invention relates to a special device for lightning protection and electrical grounding engineering, in particular to a monitorable low resistance module grounding device. Background technique [0002] At present, in all lightning protection and electrical grounding projects such as power plants, substations, and control rooms, galvanized round steel, flat steel, and angle steel are mostly used as horizontal grounding and vertical grounding electrodes, buried in the soil below 0.8-3.0m . However, in high soil resistivity and arid areas, due to the lack of auxiliary conduction of free ions in the soil, the grounding resistance of the grounding system is difficult to meet the requirements. Usually, the soil is replaced, chemical or physical resistance reducing agents are added, deep wells are drilled, vertical electrodes are buried, and extended Measures such as the area of ​​the grounding grid to reduce the grounding resistance. These methods are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R4/66G01R27/20
Inventor 于国先王茂成吕良
Owner 吕良
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