Quad flat no-lead encapsulation structure and encapsulation method thereof
A technology of leadless packaging and packaging method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the degradation of pin insulation performance, the deterioration of conductive pin insulation properties, and limit the application of QFN packaging technology. field and other issues, to achieve the effect of improving insulation properties
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[0019] The specific implementation of the quad flat no-lead packaging structure and packaging method provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0020] Attached figure 2 In the illustrated embodiment of the present invention, the schematic diagram of the implementation steps of the packaging method includes the following steps: step S10, providing a flat film with a sticky surface; step S11, using the chip base and lead frame for packaging the chip Adhere to the sticky surface of the film; step S12, use the first injection mold and insulating glue to inject the chip base and the lead frame; step S13, remove the film, the first injection mold and the insulating glue; step S14 , Adhere the chip on the exposed surface of the chip base with conductive glue; Step S15, electrically connect the pads on the chip surface with the pins of the lead frame; Step S16, Use the second injection mold and insulating glue to ali...
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