Semiconductor device
A semiconductor and device technology, applied in the field of structure and manufacturing process of junction barrier Schottky devices, can solve the problems of low forward voltage drop switching speed, affecting the switching speed of devices, and not being able to take full account of the problems, so as to reduce the positive voltage drop. The effect of the voltage drop, the optimization of electrical parameter characteristics, and the compact structure
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Embodiment 1
[0031] figure 1 Shows a schematic cross-sectional view of the first example of the semiconductor device of the present invention, combined below figure 1 The semiconductor device of the present invention will be described in detail.
[0032] A semiconductor device includes: a substrate layer 1, which is an N conductivity type semiconductor material, and a cathode is drawn out through a metal on the lower surface of the substrate layer; a drift layer 2, located on the substrate layer 1, is an N conductivity type semiconductor material; a depletion layer 3 , located on the drift layer 2, the depletion layer is an N-conduction type semiconductor material; the heavily doped layer 4 is located on the depletion layer, and is an N-conduction type semiconductor material; the reverse bias leakage current suppression structure region 7 is multi The P-type regions are separately formed in the drift layer, the depletion layer and the heavily doped layer, and each anti-bias leakage curren...
Embodiment 2
[0038] figure 2 Shown is a schematic cross-sectional view of the second embodiment of the semiconductor device of the present invention, combined below figure 2 Detailed description.
[0039] Other structures are as in Embodiment 1, a plurality of separated reverse bias leakage current suppression structure regions 7 are formed in the drift layer 2, depletion layer 3 and heavily doped layer 4, and the reverse bias leakage current suppression structure region 7 is a trench structure , including a trench insulating layer 10 and polysilicon 11 filled in the trench insulating layer 10 , the width of each reverse bias leakage current suppression structure region 7 is 2-6um, and the distance between each other is 2-10um.
[0040]A drift layer 2, a depletion layer 3 and a heavily doped layer 4 are formed on the substrate layer 1 by means of epitaxial production, and the phosphorus impurity concentration in the drift layer is set to, for example, 2×10 15 Atom / CM 3 , the phosphoru...
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