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Method for preparing Ag inner electrode multilayer ceramic capacitors

A multi-layer ceramic and internal electrode technology, applied in the direction of multilayer capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., can solve the problems affecting the temperature stability and withstand voltage performance of ceramic materials, and achieve low dielectric loss and optimal NPO. Features, good stability

Inactive Publication Date: 2010-06-23
TSINGHUA TONGFANG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

BaO-Ln sintered in the temperature range of 850~1000℃ 2 o 3 -TiO 2 The dielectric constant of ternary ceramics is basically in the range of 20 to 70; and its large content of glass frit doping also affects the temperature stability and pressure resistance of ceramics

Method used

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  • Method for preparing Ag inner electrode multilayer ceramic capacitors
  • Method for preparing Ag inner electrode multilayer ceramic capacitors
  • Method for preparing Ag inner electrode multilayer ceramic capacitors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The raw material in the main material BLT ceramic material is BaCO 3 、Nd 2 o 3 、 Bi 2 o 3 and TiO 2 , wherein each raw material composition according to BaCO 3 : 15.0ml%; Nd 2 o 3 : 14.54ml%; Bi 2 o 3 : 3.19ml%; TiO 2 : 67.22ml% ratio weighing. After ball milling, drying and calcination processes, the main material powder is made. Auxiliary material BBZS glass 1 and BLCS glass 2 mixture powder, the raw materials are Bi 2 o 3 , B 2 o 3 , ZnO and SiO 2 and BaO, Li 2 O, CaO, SrO, and SiO 2 . Among them, BBZS glass-each raw material composition according to Bi 2 o 3 : 83.17wt%; B 2 o 3 : 6.55wt%; ZnO: 9.05wt%; SiO 2 : 1.23wt% proportioning weighing, BLCS glass two raw material components according to BaO: 24.26wt%; Li 2 O: 8.8wt%; CaO: 12.14wt%; SrO: 0.0wt%; SiO 2 : 54.8wt% proportioning and weighing. After the glass 1 powder and glass 2 powder are ball milled, dried and vitrified, the two glass frits are mixed again, and the mixing weight percenta...

Embodiment 2

[0038] The raw material in the main material BLT ceramic material is BaCO 3 、Nd 2 o 3 、 Bi 2 o 3 and TiO 2 , wherein each raw material composition according to BaCO 3 : 15.05ml%; Nd 2 o 3 : 14.54ml%; Bi 2 o 3 : 3.19ml%; TiO 2 : 67.22ml% ratio weighing. After ball milling, drying and calcination processes, the main material powder is made. Auxiliary material BBZS glass 1 and BLCS glass 2 mixture powder, the raw materials are Bi 2 o 3 , B 2 o 3 , ZnO and SiO 2 and BaO, Li 2 O, CaO, SrO, and SiO 2 . Among them, BBZS glass-each raw material composition according to Bi 2 o 3 : 76.72wt%; B 2 o 3 : 9.05wt%; ZnO: 12.52wt%; SiO 2 : 1.71wt% proportioning weighing, BLCS glass two raw material components according to BaO: 24.26wt%; Li 2 O: 8.8wt%; CaO: 12.14wt%; SrO: 0.0wt%; SiO 2 : 54.8wt% proportioning and weighing. After the glass 1 powder and glass 2 powder are ball milled, dried and vitrified, the two glass frits are mixed again, and the mixing weight percen...

Embodiment 3

[0042] The raw material in the main material BLT ceramic material is BaCO 3 、Nd 2 o 3 、 Bi 2 o 3 and TiO 2 , wherein each raw material composition according to BaCO 3 : 15.16ml%; Nd 2 o 3 : 14.65ml%; Bi 2 o 3 : 3.22ml%; TiO 2 : 66.97ml% ratio weighing. After ball milling, drying and calcination process, the powder material of the main component is made. Auxiliary material BBZS glass 1 and BLCS glass 2 mixture powder, the raw materials are Bi 2 o 3 , B 2 o 3 , ZnO and SiO 2 and BaO, Li 2 O, CaO, SrO, and SiO 2 . Among them, BBZS glass-each raw material composition according to Bi 2 o 3 : 70.66wt%; B 2 o 3 : 12.84wt%; ZnO: 14.08wt%; SiO 2 : 2.42wt% proportioning weighing, BLCS glass two raw material components according to BaO: 23.13wt%; Li 2 O: 8.8wt%; CaO: 9.39wt%; SrO: 3.48wt%; SiO 2 : 55.2wt% proportioning and weighing. After the glass 1 powder and glass 2 powder are ball milled, dried and vitrified, the two glass frits are mixed again, and the mixi...

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Abstract

A method for preparing Ag inner electrode multilayer ceramic capacitors relates to the technical field of ceramic materials. The method of the invention comprises the steps that: (1)aBao-bLn2O3-cBi2O3-dTiO2 serving as the mother material, eBi2O3-fB2O3-gZnO-hSiO2 glass serving and jBaO-kLi2O-lCaO-mSrO-nSiO2 glass which serve as the auxiliary materials are mixed with each other to form the mixture; (2) the mixture ball milled is dried; (3) the mixture is mixed with organic solvent and the obtained mixture is ball milled to overlap the dielectric layer with the Ag inner electrode to form the unfired body of the multilayer ceramic capacitor; (4) the temperature of the unfired body is maintained at a temperature of 300 DEG C; (5) the unfired body is sintered in the air atmosphere; (6) the unfired body is cooled down to the room temperature; (7) the temperature of the Ag inner electrode used as the unfired body of a terminal electrode is maintained at a furnace temperature ranging from 600 to 850 DEG C; (8) the Ag inner multilayer ceramic capacitor is obtained after the terminal electrode is baked and cooled down. The method for preparing Ag inner electrode multilayer ceramic capacitors is characterized by simple preparation process, small dielectric loss and good stability, the prepared multilayer ceramic capacitor has high withstand voltage strength, high dielectric constant, capacitor temperature change rate in conformity with the NPO feature standards.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a method for preparing a silver internal electrode multilayer ceramic capacitor. Background technique [0002] Multilayer Ceramic Capacitors (Multilayer Ceramic Capacitors) referred to as MLCC, it is the electrode material and the ceramic green body alternately stacked in multiple layers and fired into a whole. With the miniaturization and chipping of ceramic electronic components, the number of layers of internal circuits and internal electrodes in the same volume of chip components is increasing rapidly, that is, the cost of internal electrodes in chip components is increasing. , This objectively requires that the internal electrode material of the laminated chip component must gradually be replaced by a lower-cost pure silver electrode from platinum and platinum-silver electrodes with high cost. However, the pure silver inner electrode brings another problem. The me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/005C04B35/462
Inventor 吉岸袁纪烈陈月光王士娇张力
Owner TSINGHUA TONGFANG CO LTD
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