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Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method

A cyanide-free silver plating and electroplating solution technology, which is applied in the field of cyanide-free silver plating and electroplating solution for cyanide-free silver plating, can solve the problems of difficult maintenance and easy passivation of plated parts, and achieve good brightness, stability and Excellent dispersibility and smooth surface

Inactive Publication Date: 2010-06-30
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The latter two electroplating solutions are difficult to maintain, and the plated parts are prone to passivation in the air

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The formula and preparation method of the electroplating solution of the cyanide-free silver plating of the present embodiment are

[0019] The formula of the electroplating solution is: silver nitrate 40g / L, sodium thiosulfate 200g / L, potassium metabisulfite 40g / L, ammonium acetate 20g / L, thiosemicarbazide 0.6g / L, and the pH is maintained at 5-6.

[0020] The preparation method of the electroplating solution: first dissolve 200g of sodium thiosulfate in 300ml of distilled water, stir to make it all dissolve; then dissolve 40g of silver nitrate and 40g of potassium metabisulfite in 250ml of distilled water, and stir Pour the potassium metabisulfite solution into the silver nitrate solution to form a cloudy silver metabisulfite solution, and immediately add the solution slowly into the sodium thiosulfate solution to complex the silver ions with sodium thiosulfate to form a yellowish color. Clarifying liquid; then add 20g of ammonium acetate into the solution, and after t...

Embodiment 2

[0022] The formula and preparation method of the electroplating solution of the cyanide-free silver plating of the present embodiment are

[0023] The formula of the electroplating solution is: silver nitrate 43g / L, sodium thiosulfate 230g / L, potassium metabisulfite 43g / L, ammonium acetate 25g / L, thiosemicarbazide 0.7g / L, and the pH is maintained at 5-6.

[0024] The preparation method of the electroplating solution: the preparation method is the same as in Example 1, except that the addition of each component is adjusted accordingly according to the formula requirements.

Embodiment 3

[0026] The formula and preparation method of the electroplating solution of the cyanide-free silver plating of the present embodiment are

[0027] The formula of the electroplating solution is: silver nitrate 45g / L, sodium thiosulfate 250g / L, potassium metabisulfite 45g / L, ammonium acetate 30g / L, thiosemicarbazide 0.8g / L, and the pH is maintained at 5-6.

[0028] The preparation method of the electroplating solution: the preparation method is the same as in Example 1, except that the addition of each component is adjusted accordingly according to the formula requirements.

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PUM

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Abstract

The invention discloses an electroplating solution for cyanide-free silver plating and a cyanide-free silver plating method, wherein the electroplating solution is formed by preparing the following components: 40-45g / L silver nitrate, 200-250g / L sodium thiosulfate, 40-45g / L potassium metabisulfite, 20-30g / L ammonium acetate and 0.6-0.8g / L thiosemicarbazide; and the cyanide-free silver plating method mainly comprises the following steps: polishing, deoiling and activating a plating part, depositing silver plating by direct current, and passivating. The electroplating solution of the invention has excellent stability and dispersibility; by the DC deposition method, the silver coating reaches the nanoscale, which is well combined with a substrate with smooth and compact surface, good radiance, strong anti-tarnishing capability, simple process, convenient operation, low cost and capability of meeting requirement of the production field.

Description

technical field [0001] The invention relates to an electroplating solution for cyanide-free silver plating, and also relates to a cyanide-free silver plating method, which is a cyanide-free silver plating method under direct current electrodeposition, and belongs to the technical field of electrochemical silver plating. Background technique [0002] Silver is a silvery-white, malleable, plastic and reflective precious metal. The silver-plated layer has good electrical conductivity, brazing property, low contact resistance and high reflection coefficient. It is widely used in electrical appliances, electronics, communication equipment and instruments Instrument manufacturing and other industrial fields. The current silver plating methods mostly use electroplating methods such as direct current silver plating or pulse silver plating; in actual production, most of the silver plating solutions use cyanide electroplating, which is a highly toxic substance that causes serious poll...

Claims

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Application Information

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IPC IPC(8): C25D3/46
Inventor 任凤章殷立涛王姗姗马战红赵士阳田保红王宇飞贾淑果
Owner HENAN UNIV OF SCI & TECH
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