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Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device

A manufacturing method, semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device testing/measurement, electric solid-state devices, etc.

Inactive Publication Date: 2013-01-02
SOCIONEXT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0035] In order to avoid this problem, a mask for a semiconductor element and a mask for a product are prepared having a specific circuit pattern different from that of a product, which leads to manufacturing cost the rise of

Method used

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  • Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device
  • Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device
  • Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device

Examples

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no. 1 example

[0083] The first embodiment of the method for selecting non-defective semiconductor elements according to the present invention will be described using the drawings.

[0084] figure 1 It is a flowchart showing the selection process of the semiconductor element in this embodiment.

[0085] In this embodiment, in the wafer processing step 10, a plurality of semiconductor elements are formed on the main surface of one side of the semiconductor substrate (semiconductor wafer).

[0086] Next, bump electrodes (bumps) are formed on the respective semiconductor elements formed on the semiconductor substrate as external connection terminals (bump forming step 20).

[0087] At this time, at least one semiconductor element formed outside the effective area of ​​the semiconductor substrate is provided with a bump for identification. The semiconductor element provided with the identification bump is used as a reference semiconductor element.

[0088] Next, using test probes, electrical tests are p...

no. 2 example

[0139] The drawings are used to illustrate the second embodiment of the method for selecting non-defective chips according to the present invention.

[0140] In this embodiment, a plurality of semiconductor elements are used, and identification bumps 261 are respectively arranged for each semiconductor element. A part of the semiconductor element is included in the effective area of ​​the semiconductor substrate (encircled by the dotted circle ES). Area), while the other part is located outside the effective area.

[0141] The feature of this embodiment lies in the arrangement structure of bumps on the plurality of non-product semiconductor elements (non-product semiconductor chips) and the utilization mode of the plurality of non-product semiconductor components (non-product semiconductor chips).

[0142] That is, as Figure 9A As shown, there are a plurality of semiconductor elements (non-productive semiconductor chips) that are partly included in the effective area of ​​the semico...

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Abstract

A method for sorting and acquiring a semiconductor element, including: disposing a plurality of semiconductor elements in an effective section in a semiconductor substrate; disposing a standard semiconductor element outside of the effective section in the semiconductor substrate; forming a bump in each of the plurality of the semiconductor elements and in the standard semiconductor element; performing a test on the plurality of the semiconductor elements in the effective section; forming a location map using the standard semiconductor element as a base point; and picking up the semiconductor elements determined as non-defective in the test from the plurality of the semiconductor elements based on the location map.

Description

technical field [0001] The present invention relates to a selection method capable of efficiently and reliably selecting a defect-free (defective product) semiconductor element from a plurality of semiconductor elements (semiconductor chips) formed on a semiconductor substrate (semiconductor wafer), a semiconductor device and its manufacture method. Background technique [0002] In recent years, in the manufacture of semiconductor devices, it is desired to obtain more semiconductor elements (semiconductor chips) from one semiconductor substrate (semiconductor wafer) in order to mass-produce them and reduce their manufacturing costs. [0003] Therefore, depending on the type and specification of the semiconductor element, thousands or more semiconductor elements may be obtained from one semiconductor substrate. [0004] On the other hand, along with the miniaturization and weight reduction of electronic equipment on which the semiconductor devices are mounted, the thickness ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L24/11H01L2924/014H01L22/20H01L24/05H01L2224/05001H01L2224/05022H01L2224/05572H01L2224/056H01L2924/00014H01L2224/05099
Inventor 金野吉人山田豊
Owner SOCIONEXT INC