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Base plate structure and semiconductor encapsulation structure comprising the same

A semiconductor and substrate technology, which is applied in the field of semiconductor packaging structure, can solve the problems that the solder film is not easy to form, the solder film corrodes copper lines, etc.

Active Publication Date: 2010-07-07
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solder film has the problem of corroding the copper lines underneath it, and due to the reflow process, the solder film is not easy to be accurately formed on the copper lines

Method used

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  • Base plate structure and semiconductor encapsulation structure comprising the same
  • Base plate structure and semiconductor encapsulation structure comprising the same
  • Base plate structure and semiconductor encapsulation structure comprising the same

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Embodiment Construction

[0012] refer to figure 1 and 2a , The substrate structure 100 of the present invention includes a substrate 110, and a patterned circuit layer 120 is disposed on the substrate 110, and the circuit layer 120 includes a plurality of conductive circuits 122 made of metal. The insulating layer 130 , such as a solder resist layer, covers the circuit layer 120 and has an opening 132 exposing a part of each conductive circuit 122 . The bare part of each conductive circuit 122 is covered with conductive glass 140 , such as Indium Tin Oxide (ITO); or the exposed parts of multiple conductive circuits 122 with the same potential can be covered with the same conductive glass 140 . In order to make the conductive glass 140 easily bonded to the input and output contacts of the chip, the width of the conductive glass 140 is preferably larger than the width of the covered conductive lines 122 . In addition, since the conductive lines 122 formed on the substrate 110 are generally not smooth,...

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PUM

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Abstract

The invention provides a base plate structure and a semiconductor encapsulation structure comprising the same. The base plate structure comprises a base plate, wherein a patterning circuit layer is formed on the base plate, the patterning circuit layer comprises a plurality of conductive circuits, an insulation layer is covered on the patterning circuit layer and is provided with an opening, and at least one part of the conductive circuits is exposed out. A plurality of pieces of conductive glass are covered on the exposed part of the conductive circuits.

Description

technical field [0001] The present invention relates to a substrate structure and a semiconductor package structure comprising the substrate structure, more particularly to a substrate structure and a semiconductor package structure comprising the substrate structure, in which patterned lines on the substrate are provided with conductive glass for supplying chip electrical for sexual connection. Background technique [0002] Recently, a technology called Super Juffit has been developed by Showa Denko K.K., which is a technology for disposing components such as chips on a substrate. This Super Juffit technology includes forming an adhesive film on the copper circuit of the substrate, coating solder power on the adhesive film, and then melting the solder powder by reflow process to form a solder film on the copper circuit. , the output and input contacts on the chip are then electrically connected to the solder film, so as to achieve the purpose of electrically connecting the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/488
CPCH01L2224/16225H01L2224/32225H01L2224/73204
Inventor 梁荣华
Owner ADVANCED SEMICON ENG INC