Method for treating surfaces of plates

A surface treatment and board technology, applied in secondary treatment of printed circuits, improvement of metal adhesion of insulating substrates, etc., can solve the problems of insufficient roughness, unable to further improve the tightness of PCB or dry film lamination, etc. Achieving better roughening effect and good binding effect

Inactive Publication Date: 2010-07-14
TRIPOD WUXI ELECTRONICS
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The black brown surface roughening treatment is to use chemical corrosion to increase the roughness of the copper foil substrate surface. Although it has a certain effect, the roughness is still insufficient, and the pressing and fastening of PCB or dry film cannot be further improved. Spend

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for treating surfaces of plates
  • Method for treating surfaces of plates
  • Method for treating surfaces of plates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The implementation of the present invention will be described in more detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it after studying this specification.

[0029] figure 1 It is a schematic flow chart of applying the board surface treatment method of the present invention to the surface treatment before PCB lamination. It includes the following steps:

[0030] Step 101, providing a semi-finished copper foil substrate;

[0031] Step 102, performing electrolytic roughening on the surface of the copper foil substrate with a high current density;

[0032] Step 103, performing electrolytic roughening on the surface of the copper foil substrate with a low current density;

[0033] Step 104, performing heat-resistant treatment on the copper foil substrate;

[0034] Step 105, performing anti-oxidation treatment on the copper foil substrate;

[0035] Step 106, coating resin on the surface of the copper foil substr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for treating the surfaces of plates, comprising the following steps of: electrolyzing and coarsening the surfaces of copper foil base plates by sequentially adopting high current density and low current density, and then coating resins on the coarsened surfaces of the copper foil base plates so that a dry film for development and exposure can be pressed on the copper foil base plate. After the electrolyzed and coarsened copper foil base plates are sequentially subjected to heat-resistant treatment and oxidation-resistant treatment, the surfaces of the copper foil base plates can be coated with the resins, thereby two copper foil base plates can be laminated.

Description

technical field [0001] The invention relates to a method for processing a printed circuit board, in particular to a method of roughening the surface of the copper foil substrate before pressing the copper foil substrate to a dry film or pressing a circuit board, so as to improve the bonding degree of the resin and the dry film or copper foil substrate method. Background technique [0002] Printed Circuit Board (hereinafter referred to as PCB) is formed by stacking and laminating multiple substrates etched with circuits. The substrate is composed of resin, reinforcing material and metal foil. ; The most common substrate is copper clad substrate (Copper Clad Laminate, referred to as CCL). Copper foil substrates are divided into three categories according to the different substrate materials, namely paper substrates, composite substrates and FR-4 substrates. Their characteristics and uses are also different, among which FR-4 is currently the mainstream. [0003] When pressing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
Inventor 杨伟雄赖永忠徐国彰
Owner TRIPOD WUXI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap