Construction method of anti-electromagnetic interference electronic module
An anti-electromagnetic interference, electronic module technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of occupying electronic product space, malfunction, wire signal interference, etc.
Inactive Publication Date: 2011-05-25
TONG HSING ELECTRONICS IND LTD
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Problems solved by technology
[0003] However, when the electronic components are miniaturized, because the distance between the wires is shortened, the signals between the wires interfere with each other, so it is necessary to add a circuit design to stabilize the signal; in addition, some miniaturized electronic components, especially It is an electronic module used in the middle and high frequency bands or high frequency bands, and it is easy to induce malfunctions due to external electromagnetic signals. Therefore, manufacturers using such electronic modules must finally add an anti-electromagnetic interference structure in the electronic product; takes up space inside the electronic product
Method used
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[0033] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation methods, Steps, features and their effects are described in detail.
[0034] see figure 1 , figure 2 and image 3 As shown in A, it is a top plan view of a carrier board 10 used in the construction method of the present invention, which includes a plurality of wire regions 101 arranged in a matrix, and the upper and lower surfaces of each wire region 101 form signal lines and grounding lines 12 respectively, wherein The upper surface is used for fixing at least one chip 20 ; in this embodiment, the at least one grounding line 12 on the upper surface respectively extends to the boundary 102 of at least one adjacent wire region 101 .
[0035] see figure 2 , Figure 5 and Image 6 As shown in A, it is a bottom plan view of another carrier board 10a used in the construction method of the present invention,...
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The invention relates to a construction method of an anti-electromagnetic interference electronic module, which comprises the following steps: after a glue sealing technology for constructing electronic modules, cutting downwards along the boundaries of the electronic modules from a glue body on a supporting board until cutting off a part of ground conductors on the supporting board, wherein the supporting board is not cut off; thus, forming a plurality of cutting grooves on the glue body; then, sputtering the supporting board; plating a metal layer on the surfaces of the glue body and the cutting grooves evenly to enable the metal layer to be connected with the ground conductor of the supporting board; finally, carrying out the second cutting step, cutting off the supporting board along the cutting grooves, and completing the construction of a plurality of single electronic modules. Because the metal layer of the glue body of each electronic module is electrically connected with the ground conductor of the supporting board, the electronic module can be used for resisting electromagnetic interference.
Description
technical field [0001] The invention relates to a method for assembling an electronic module, in particular to a method for assembling an electronic module with anti-electromagnetic interference. Background technique [0002] Due to the development of semiconductor technology and semiconductor packaging technology, the final component products after the assembly of semiconductor electronic components can be more miniaturized and thinner; it also enables the current electronic products to be designed in a thinner and lighter direction. [0003] However, when the electronic components are miniaturized, because the distance between the wires is shortened, the signals between the wires interfere with each other, so it is necessary to add a circuit design to stabilize the signal; in addition, some miniaturized electronic components, especially It is an electronic module used in the middle and high frequency bands or high frequency bands, and it is easy to induce malfunctions due ...
Claims
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IPC IPC(8): H01L25/00H01L21/50H01L21/60H01L21/3205H01L23/552
CPCH01L23/552H01L2224/97H01L2224/48227H01L25/0655H01L24/97H01L2924/14
Inventor 江大祥
Owner TONG HSING ELECTRONICS IND LTD