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Polishing composition

A technology of composition and compound, applied in the direction of polishing composition containing abrasive, grinding device, grinding machine, etc., can solve the problems of flatness not improved, copper grinding speed cannot be obtained, etc.

Inactive Publication Date: 2010-08-25
NITTA HAAS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, the conventional polishing composition has not been able to obtain a sufficient copper polishing rate, and the flatness has not been improved, so it is desired to have a polishing composition that can realize a higher polishing rate and can improve the flatness at the same time.

Method used

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  • Polishing composition
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Abstract

Disclosed is a polishing composition which enables to realize a high polishing rate, while improving flatness. Specifically disclosed is a polishing composition suitable for a metal film, particularly for a copper (Cu) film. This polishing composition contains a basic compound containing an ammonium group, an alkylbenzene sulfonate having an alkyl group with 9-18 carbon atoms, hydrogen peroxide and the balance of water. Ammonium hydroxide can be used as the basic compound, and dodecylbenzene sulfonate or the like can be used as the alkylbenzene sulfonate.

Description

abrasive composition technical field The present invention relates to a polishing composition for polishing metal films, especially copper films. Background technique In order to meet the requirements of high integration and miniaturization of semiconductor integrated circuits (LSI), a technology called system-in-package (SIP) has been developed. In this technology, memory functions and logic functions are three-dimensionally mounted on a single substrate. Multiple semiconductor elements with various functions. Along with this, the number of wirings and bumps formed on the substrate increases, and the diameter of each wiring becomes smaller, making it difficult to form fine wirings by conventional buildup methods and mechanical grinding methods. Therefore, instead of aluminum, which has been conventionally used as a wiring material, copper, copper alloy, or the like, which has lower electrical resistance than aluminum, has been used. However, since it is difficult for c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304B24B37/00C09K3/14
CPCC09G1/02C23F3/04H01L21/3212
Inventor 松村义之新田浩士
Owner NITTA HAAS INC