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Method for manufacturing electronic emission element

A production method and electron emission technology, which is applied in the manufacture of electrical components, discharge tubes/lamps, electrode systems, etc., can solve problems such as difficult control, and achieve the effect of improving the characteristics of components and increasing production capacity

Inactive Publication Date: 2010-09-15
华映视讯(吴江)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, shrinking the crack G' from sub-micron to nano-scale is a very delicate and difficult-to-control process technology

Method used

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  • Method for manufacturing electronic emission element
  • Method for manufacturing electronic emission element
  • Method for manufacturing electronic emission element

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Experimental program
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Embodiment Construction

[0025] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Figure 3A ~ Figure 3E It is a cross-sectional schematic diagram of the steps of the manufacturing method of the electron emission device according to an embodiment of the present invention. Next, please refer to the Figure 3A ~ Figure 3E , to understand the fabrication method of the electron emission element of this embodiment.

[0027] First, please refer to Figure 3A , providing a substrate 310 . In this embodiment, the material of the substrate 310 is, for example, silicon or glass.

[0028] Furthermore, please refer to Figure 3B , forming a first electrode 320 a and a second electrode 320 b on the substrate 310 . In this embodiment, the materials of the first electrode 320 a and the second electrode 320 b are, for example, selected from nickel, chromium, gold, molybdenum, tungsten, platinum, titanium, aluminum, copper, palladium, tantalum, silver...

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Abstract

The invention relates to a method for manufacturing an electronic emission element. The method comprises the following steps of: firstly, providing a substrate; secondly, forming a first electrode and a second electrode on the substrate; thirdly, forming a conductive layer on the substrate to cover the first electrode and the second electrode; fourthly, patterning the conductive layer to form a first conductive layer, a second conductive layer and a crack, wherein the crack is located between the first conductive layer and the second conductive layer; and fifthly, carrying out a plasma process on the first conductive layer and the second conductive layer.

Description

technical field [0001] The present invention relates to a manufacturing method of an electron source device, and in particular to a manufacturing method of an electron-emitting device. Background technique [0002] A field emission display (Field Emission Display, FED) is a flat display technology similar to a conventional cathode ray tube display (Cathode Ray Tube Display, CRT). The principle of the field emission display is briefly described as follows. First, a plurality of electron source elements emit electrons from their cathode sides under the induction of an electric field. Then, the electrons are attracted and accelerated by the anode, and hit the phosphor on the surface of the anode to emit fluorescence. The fluorescent light then penetrates the anode and exits the back of the anode, where an image is displayed on the back of the anode (the front of the display panel). [0003] According to different electron emission methods, electron source elements can be div...

Claims

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Application Information

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IPC IPC(8): H01J9/02
Inventor 蔡志豪陈冠荣潘扶民莫启能罗国忠江美昭
Owner 华映视讯(吴江)有限公司