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Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the printed IC board

A technology of printed wiring boards and integrated circuits, which is applied in the manufacture of printed circuits, printed circuits connected with non-printed electrical components, printed circuits, etc., and can solve the problems of reduced reliability of printed IC boards

Inactive Publication Date: 2010-09-15
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Since the insulating material contained in the printed wiring board placed above the heat stage unit dissipates ultrasonic waves and spreads the load applied to bonding parts such as conductive lines and solder bumps, this degrades the reliability of the printed IC board, and this Prevents proper bonding between bare IC chip and bumped parts such as solder bumps

Method used

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  • Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the printed IC board
  • Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the printed IC board
  • Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the printed IC board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0027] will refer to Figure 1 to Figure 2A ~2H gives a description of the printed IC board (or printed IC assembly) according to the first embodiment of the present invention.

[0028] figure 1 is a view showing the configuration of the printed IC board 1 according to the first embodiment of the present invention. Figure 2A ~ Figure 2H is a view showing main steps of manufacturing the printed IC board 1 according to the first embodiment of the present invention.

[0029]

[0030] Such as figure 1 As shown in , the printed IC board 1 is mainly composed of a multilayer printed wiring board 2, one or more bare IC chips 3 (by the way, for simplification, figure 1 Only a single bare IC chip 3) and chip components 4 such as capacitors and resistors are shown. The multilayer printed wiring board 2 has a multilayer structure in which a plurality of printed wiring patterns are stacked to realize a laminated structure, in which the printed wiring patterns are made of copper thin...

no. 2 example

[0050] will refer to Figure 3A ~ Figure 3C and Figure 4A ~ Figure 4E A description is given of a printed IC board 1-1 according to a second embodiment of the present invention.

[0051] Figure 3A , Figure 3B and Figure 3C is a view showing the configuration of a printed IC board 1 - 1 according to a second embodiment of the present invention. Figure 4A ~ Figure 4E is a view showing main steps of producing the printed IC board 1-1 according to the second embodiment of the present invention.

[0052]

[0053] Such as Figure 3A , Figure 3B and Figure 3C As shown in , the printed IC board 1-1 has a multilayer printed wiring board 2-1 that is structurally different from the multilayer printed wiring board 2 in the printed IC board 1 according to the first embodiment. The following description will explain elements different from those of the printed IC board 1 according to the first embodiment, and will not explain the same elements between the first and second e...

no. 3 example

[0066] will refer to Figure 5 and Figure 6A ~ Figure 6G A description is given of a printed IC board 1-2 according to a third embodiment of the present invention.

[0067] Figure 5 is a view showing the configuration of the printed IC board 1-2 according to the third embodiment of the present invention. Figure 6A ~ Figure 6G is a view showing main steps of producing the printed IC board 1-2 according to the third embodiment of the present invention.

[0068]

[0069] Such as Figure 5 As shown in , the printed IC board 1-2 according to the third embodiment has a structure different from the multilayer printed wiring board 2 in the printed IC board 1 according to the first embodiment and is also different from that according to the second embodiment. The multilayer printed wiring board 2-2 of the multilayer printed wiring board 2-1 in the printed IC board 1-1.

[0070]Since the printed IC board 1-2 according to the third embodiment is different from the printed IC bo...

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PUM

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Abstract

The present invention relates to a printed wiring board, a printed IC board having the printed wiring board, and a method of manufacturing the printed IC board. The printed IC board has a multilayer printed wiring board and one or more bare IC chips. The multilayer printed wiring board has insulation layers made of PTFE, and wiring patterns formed on the insulation layers which are stacked to make a lamination structure. Electrode parts as parts of the wiring patterns are electrically connected to the bare IC chip. A copper member which serves as a reinforcing member is laid in a region formed in the insulation layers other than a first insulation layer. the region is formed directly below the electrode parts. The region is formed in a direction Z along a thickness of the stacked insulation layers. The region formed directly below the electrode parts in the insulation layers in the insulation layers other than the first insulation layer has a higher rigidity than the insulation layers.

Description

technical field [0001] The present invention relates to a printed wiring board, a printed integrated circuit (IC) board (or printed IC assembly) consisting of one or more bare IC chips and a printed wiring board having an insulating layer and a printed wiring pattern, and a A method of manufacturing the printed wiring board and the printed IC board. Background technique [0002] Various types of printed IC boards (or printed IC assemblies) consisting of printed wiring boards are known. For example, a printed wiring board has an insulating layer and a printed wiring pattern made of conductive lines such as copper wires. This insulating layer is made of an insulating material selected according to its application. A printed IC board includes a printed wiring board and a plurality of bare IC chips made of a semiconductor such as silicon disposed on the printed wiring board. [0003] Generally, a step of manufacturing a printed IC board uses a wire bonding or flip chip bondin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H05K3/34
CPCH01L2924/01015H05K2201/015H05K1/181H01L2224/85205H01L2924/19105H05K1/034H01L2924/15153H01L2924/01004H01L2924/15157H05K2201/09781H01L2924/3511H05K2203/049H01L2224/16H01L2924/30105H01L2924/1517H01L2924/01019H01L23/49822H01L23/13H01L2924/19041H05K2201/10674H01L2224/48091H01L2924/01013H01L2224/45147H01L2224/32225H01L2224/92247H01L2224/92H05K2201/2009H01L24/45H01L2924/19043H01L2924/3011H01L24/48H01L2924/01079H01L2224/49433H01L2224/48227H01L2924/14H01L24/49H05K1/183H01L2924/01078H01L2924/01014H05K3/4632H01L24/16H01L2224/45144H01L2224/73265H01L2224/49175H05K1/0271H01L23/5389H01L23/49894H01L24/73H01L2224/13144H01L2224/13147H01L2224/2919H01L2224/2929H01L2224/81205H01L2924/00011H01L2924/00014H01L2924/01047H01L2924/10253H01L2924/30111Y10T29/4913Y10T29/49155Y10T29/49165H01L2924/00H01L2924/00012H01L2224/0401H01L2924/0665H01L2924/0715
Inventor 孝谷卓哉
Owner DENSO CORP
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