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Tray for epoxy molding compound powder and apparatus for providing epoxy molding compound powder having the tray

A compound and molding technology, used in electrical components, circuits, electrical solid devices, etc., can solve the problems of EMC gel damage to wiring, molding processing costs, and long time, to prevent bare core defects and reduce mechanical friction. small effect

Inactive Publication Date: 2010-09-15
SECRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the flow of EMC gel can damage the wiring of the electrical connection between the die and the contact pad, which can cause deviation of the wiring, for example
[0005] In addition, the molding process does not end until the thick EMC layer has completely changed to EMC gel, so it takes a greater amount of time to change from EMC powder to EMC gel due to the thickness of the EMC layer
Thus, a thicker EMC layer will make the molding process take more time

Method used

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  • Tray for epoxy molding compound powder and apparatus for providing epoxy molding compound powder having the tray
  • Tray for epoxy molding compound powder and apparatus for providing epoxy molding compound powder having the tray
  • Tray for epoxy molding compound powder and apparatus for providing epoxy molding compound powder having the tray

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Embodiment Construction

[0033] The invention will be described in more detail hereinafter with reference to the accompanying drawings showing embodiments of the invention. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In these drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0034] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or directly connected to the other element or layer. Layers, or the presence of intervening elements or layers. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or lay...

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PUM

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Abstract

In a tray for storing epoxy molding compound (EMC) powder and an apparatus for providing the EMC powder, the tray includes a body of which the top and bottom portions are open, at least one shutter movably installed at the bottom portion of the body and a plurality of wirings installed across the body. The EMC powder is stored in the tray, and the bottom portion of the body is opened or closed according to a movement of the shutter. The EMC powder is deposited on the shutter when the bottom of the body is closed and is dropped downwards when the bottom of the body is opened. The wirings may prevent the EMC powder from leaning to one side of the body when the bottom of the body is opened. Accordingly, the EMC powder may be deposited in the mold with high uniformity.

Description

technical field [0001] Embodiments of the present invention relate to a tray for storing epoxy molding compound (EMC) powder and an apparatus for supplying EMC powder using the tray. The examples of the present invention particularly relate to a tray in which EMC is evenly stored and evenly poured into a bare core mold, and a method for providing EMC powder using the tray. Background technique [0002] Generally, the packaging process of a semiconductor device includes a dicing process of dividing a semiconductor wafer into a plurality of semiconductor chips (each of which is called a die), a bonding process of bonding the die to a substrate, making the die Wire bonding processing to electrically connect connection pads of the substrate, molding processing to mold the die and the peripheral portion of the die, and soldering processing to electrically connect ball pads of the substrate to external terminals. [0003] In the molding process, epoxy molding compound (EMC) powde...

Claims

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Application Information

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IPC IPC(8): H01L23/02
CPCB29C31/04B29K2063/00B29C31/066H01L23/043
Inventor 金瑄旿
Owner SECRON
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