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Large-size direct type LED backlight source and preparation method

An LED backlight source, direct type technology, applied in the field of high-power LED backlight source structure and its preparation, achieves the effects of low energy consumption, reduced manufacturing and use costs, and prolonged heat dissipation problems

Inactive Publication Date: 2012-02-15
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the problem of heat dissipation of the circuit and its chip is particularly prominent.

Method used

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  • Large-size direct type LED backlight source and preparation method
  • Large-size direct type LED backlight source and preparation method
  • Large-size direct type LED backlight source and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 1 As shown, a large-size direct-lit LED backlight includes a metal substrate 6, a vapor chamber, and edge-emitting LEDs. A plurality of reflective bowls 5 are stamped on the metal substrate 6, and the reflective bowls 5 are evenly distributed on the metal substrate 6, which is a bowl-shaped free-form surface structure; support columns 9A formed by punching the metal substrate 6 are arranged between the reflective bowls 5, and the support columns 9A is an inwardly concave columnar structure.

[0040] Such as figure 2 As shown, a layer of Al is plated on the surface of the metal substrate 6 by the method of micro-arc oxidation. 2 o 3 Micro-arc oxidation film, used as a high thermal conductivity insulating dielectric layer, Al 2 o 3 The surface of the micro-arc oxidation film is covered with wiring circuits 11 connected to LED chips 2 .

[0041] The lower wall shell is a frame structure, which is stamped and formed by an aluminum rectangular plate, a...

Embodiment 2

[0053] Such as Figure 7 As shown, a large-size direct-lit LED backlight includes a metal substrate 6, a vapor chamber, and edge-emitting LEDs. A plurality of reflective bowls 5 are stamped on the metal substrate 6, and the reflective bowls 5 are evenly distributed on the metal substrate 6, which is a bowl-shaped free-form surface structure.

[0054] The metal substrate 6 is a copper substrate, its surface is covered with an insulating medium layer, and the surface of the insulating medium layer is covered with a wiring circuit 11 connected to the LED chip 2 . The insulating medium layer generally adopts high thermal conductivity epoxy glass brazing cloth or epoxy resin, and its thickness is 0.08mm-0.1mm.

[0055] The lower surface of the metal substrate 6 is provided with micro-protrusions 9B with a spacing of 0.1-0.2 mm and a height of 0.1-0.2 mm; the lower wall shell 8 is a frame structure, which is punched and formed by a copper rectangular plate, and is arranged on the l...

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Abstract

The invention discloses a large-size direct type LED backlight source and a preparation method. The backlight source structure comprises an edge emission type LED, a metal basal plate and a lower wall casing; the edge emission type LED comprises a conical half-reflecting semi-permeable mirror, an LED chip, packaging resin and an LED lamp holder; a plurality of light reflecting bowls are punched on the metal basal plate and are evenly distributed on the metal basal plate, the lower wall casing is in a frame-shaped structure and is arranged at the lower end of the metal basal plate, a hollow cavity is formed between the lower wall casing and the metal basal plate, the lower surface of the metal basal plate and the upper surface of the lower wall casing are provided with fine structures in the hollow cavity, fine structures at the lower ends of the light reflecting bowls are connected with the fine structure at the upper surface of the lower wall casing, and a liquid absorption core is formed; and support columns are arranged between the adjacent light reflecting bowls, have equal heights with the light reflecting bowls and are connected with the fine structure at the upper surface of the lower wall casing, and a liquid absorption core is formed. The invention provides an LED backlight source structure compromising the performance and the energy consumption under the preconditionof low cost and realizing the lightness and the thinness of a large-size LED and a manufacturing process.

Description

technical field [0001] The invention relates to a light-emitting diode (LED) backlight source structure of a liquid crystal display (LCD), in particular to a high-power LED backlight source structure used on a large-size LCD and a preparation method thereof. The invention is applicable to all application occasions where LED point light sources need to be converted into surface light sources. Background technique [0002] Since the LCD itself does not emit light, it is necessary to find a backlight source as a light source provider for thin-film liquid crystal displays, so the performance of the backlight source determines the external visual sense of the LCD. The backlight is to convert the point light source or line light source in the backlight module into a uniformly distributed surface light source, and use a thin film to control the viewing angle, improve the optical characteristics, and make the LCD achieve the purpose of perfect display. The LCD backlight is a module...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S8/00F21V7/00F21V17/00F21V19/00F21V29/00G02F1/13357H01L33/60F21Y101/02F21V29/506F21V29/56F21V29/89
Inventor 李勇夏润生何成彬曾志新
Owner SOUTH CHINA UNIV OF TECH
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