Chip electronic component tape-casting modified slurry and preparation method thereof
A technology for electronic components and casting slurry, which is applied in the field of casting modified slurry for chip electronic components and its production to achieve the effects of increasing cost and energy consumption, increasing cracking ratio, and changing sintering density
Inactive Publication Date: 2012-08-22
SHENZHEN SUNLORD ELECTRONICS
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Problems solved by technology
[0004] The technical problem of casting modified slurry for chip electronic components of the present invention is solved by the following technical solutions
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[0028] The method of the present invention will be described below in combination with specific embodiments.
[0029] A kind of cast slurry for laminated chip components, its components and weight percentages are as follows:
[0030] C2 ceramic powder: 40-45%wt;
[0031] Polyacrylic acid resin: 39-44%wt;
[0032] Plasticizer DBP: 1.0~1.2%wt;
[0033] Equivalent mixed solvent of propyl acetate and isobutanol: 14-16%wt;
[0034] Silane coupling agent KH-570: 0.1~0.5%wt;
[0035] Dispersant BYK-100: balance.
[0036] The method for making the cast modified slurry for chip-type electronic components has the following steps in sequence:
[0037] 1) After weighing all the components by weight percentage, add them together into a ball mill and mix for 24-48 hours to obtain a uniform slurry, in which the particle size D50 of ceramic or ferrite powder is 1.0-1.5 μm;
[0038] 2) For testing, take 50g of the slurry and measure the viscosity at 25±0.5°C with a viscosity tester and 2...
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Abstract
The invention discloses a chip electronic component tape-casting slurry, which comprises the following components in percentage by weight: 40 to 45 percent of C2 ceramic powder or ferrite powder, 39 to 44 percent of polyacrylic resin, 1.0 to 1.2 percent of plasticizer, 14 to 16 percent of solvent of equivalently mixed propyl acetate and isobutyl alcohol, 0.1 to 0.5 percent of silane coupling agent, and the balance of dispersing agent BYK-100. The invention also discloses a method for preparing the chip electronic component tape-casting slurry, which comprises the following steps of: performing ball-milling and mixing on the components for 24 to 48 hours to obtain uniform slurry, wherein the granularity D50 of the ceramic powder or ferrite powder is between 1.0 and 1.5, and the viscosity of the tape-casting slurry is between 600 and 800 cps. The preparation method improves the drying toughness of the slurry at a high temperature, and has the characteristics of shortening the drying time, not improving the cost and energy consumption, not changing the magnet sintered density, and not increasing the crack ratio of the product.
Description
technical field [0001] The invention relates to casting slurry, in particular to a casting modified slurry for chip electronic components and a manufacturing method thereof. Background technique [0002] The drying process cycle in the manufacturing process of laminated chip components, and the defective products caused by drying and cracking are not only widespread, but also serious. There are two main ways to reduce drying cracking at present. One is to lower the drying temperature and reduce the internal stress in the drying process to reduce the cracking ratio, but it will increase the drying time, which not only increases energy consumption, but also prolongs production. The other is to increase the adhesive, increase the toughness and strength of the slurry film, resist the internal stress caused by drying, and reduce the cracking ratio, but it is also necessary to increase the amount of solvent to adjust the viscosity of the slurry, increase the time of debinding and ...
Claims
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IPC IPC(8): C04B35/632C04B35/26
Inventor 王清华曾向东施素立
Owner SHENZHEN SUNLORD ELECTRONICS